Payment Terms | T/T |
Supply Ability | 100000pcs/day |
Delivery Time | 3-5 work days |
Packaging Details | 24*13*12cm cartons |
Products name | TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling |
Keywords | Silicone Thermal Pad |
Thermal Conductivity | 5.0W/mK |
Density | 3.15g/cc |
Color | Dark Gray |
Hardness | 60±5 Shore 00 |
Dielectric Breakdown Voltage | >5500VAC |
Application | Notebook CPU GPU Chip |
Brand Name | Ziitek |
Model Number | TIF100-50-11F |
Certification | UL and RoHs |
Place of Origin | Vietnam |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 100000pcs/day |
Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
Products name | TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling | Keywords | Silicone Thermal Pad |
Thermal Conductivity | 5.0W/mK | Density | 3.15g/cc |
Color | Dark Gray | Hardness | 60±5 Shore 00 |
Dielectric Breakdown Voltage | >5500VAC | Application | Notebook CPU GPU Chip |
Brand Name | Ziitek | Model Number | TIF100-50-11F |
Certification | UL and RoHs | Place of Origin | Vietnam |
TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling
Ziitek TIF™100-50-11F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features:
> Good thermal conductive: 5.0W/mK
> Good thermal conductivity
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness
Applications:
> Semiconductor automated test equipment (ATE)
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
Typical Properties of TIF100-50-11F Series | ||
Property | Value | Test method |
Color | Dark Gray | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Density | 3.15g/cc | ASTM D297 |
Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
Hardness | 60±5 Shore 00 | ASTM 2240 |
Continuos Use Temp | -40 to 160℃ | ****** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 6.0 MHz | ASTM D150 |
Volume Resistivity(Ohm-cm) | 1.0X10¹² | ASTM D257 |
Fire rating | 94 V0 | UL E331100 |
Thermal conductivity | 5.0W/m-K | ASTM D5470 |
Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)
Products Size:
8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.
With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
200~500
Ecer Certification:
Verified Supplier
Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s... Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s...
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