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CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

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China TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink
China TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink

  1. China TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink
  2. China TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink

TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink

  1. MOQ: 1000pcs
  2. Price: 0.1-10 USD/PCS
  3. Get Latest Price
Payment Terms T/T
Supply Ability 100000pcs/day
Delivery Time 3-5 work days
Packaging Details 24*13*12cm cartons
Products name UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad
Sample Sample free
Materials Ceramic filled silicone elastomer
Keywords Thermal Gap Filler Pad
Thermal conductivity 0.8W/mK
Specific Gravity 2.1g/cc
Flame rating 94-V0
Hardness 27±5 Shore 00
Color Pink/Blue
Application CPU,Display card and Heat sink
Brand Name Ziitek
Model Number TIF200-08-04U
Certification RoHS
Place of Origin Vietnam

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 100000pcs/day
Delivery Time 3-5 work days Packaging Details 24*13*12cm cartons
Products name UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad Sample Sample free
Materials Ceramic filled silicone elastomer Keywords Thermal Gap Filler Pad
Thermal conductivity 0.8W/mK Specific Gravity 2.1g/cc
Flame rating 94-V0 Hardness 27±5 Shore 00
Color Pink/Blue Application CPU,Display card and Heat sink
Brand Name Ziitek Model Number TIF200-08-04U
Certification RoHS Place of Origin Vietnam

TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad

 

Product descriptions

 

TlFTM200-08-04U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

 

Features

> Good thermal conductive 0.8W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance

 

Application

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of TIFTIM200-08-04U Series
Property Value Test method
Color Pink/Blue *****
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.1g/cc ASTM D297
Thickness range 0.020"~0.200"(0.5mm~5.0mm) ASTM D374
Hardness 27±5 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Thermal conductivity 0.8W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

 

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2006

  • Total Annual:

    1000000-16000000

  • Employee Number:

    200~500

  • Ecer Certification:

    Verified Supplier

Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s... Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s...

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Get in touch with us

  • Reach Us
  • CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
  • Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
  • https://www.ziitek.com.vn/

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