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CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

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China TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer
China TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer

  1. China TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer
  2. China TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer

TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer

  1. MOQ: 1000pcs
  2. Price: 0.1-10 USD/PCS
  3. Get Latest Price
Payment Terms T/T
Supply Ability 100000pcs/day
Delivery Time 3-5 work days
Packaging Details 24*13*12cm cartons
Products name TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer
Keywords Thermal Pad
Thermal conductivity 1.0W/mK
Specific Gravity 1.9g/cc
Sample Sample free
Materials Ceramic filled silicone elastomer
Flame rating 94-V0
Hardness 45 Shore 00
Color White /Pink
Application GPU CPU Chip Display Card Heat Transfer
Brand Name Ziitek
Model Number TIF200-10-02S
Certification RoHS
Place of Origin Vietnam

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 100000pcs/day
Delivery Time 3-5 work days Packaging Details 24*13*12cm cartons
Products name TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer Keywords Thermal Pad
Thermal conductivity 1.0W/mK Specific Gravity 1.9g/cc
Sample Sample free Materials Ceramic filled silicone elastomer
Flame rating 94-V0 Hardness 45 Shore 00
Color White /Pink Application GPU CPU Chip Display Card Heat Transfer
Brand Name Ziitek Model Number TIF200-10-02S
Certification RoHS Place of Origin Vietnam

TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer

 

Product descriptions

 

TlF200-10-02s Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features

> Good thermal conductive 1.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available

 

Application

> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Typical Properties of TIFTIM200-10-02S Series
Property Value Test method
Color Pink/White *****
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 1.9g/cc ASTM D297
Thickness range 0.020"~0.250" ASTM D374
Hardness 45 Shore 00 ASTM 2240
Continuos Use Temp -60 to 200℃ *****
Dielectric Breakdown Voltage >6000 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Thermal conductivity 1.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Standard Thicknesses

0.020-inch to 0.250-inch (0.5mm to 6.35mm)

 

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

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Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2006

  • Total Annual:

    1000000-16000000

  • Employee Number:

    200~500

  • Ecer Certification:

    Verified Supplier

Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s... Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s...

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Get in touch with us

  • Reach Us
  • CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
  • Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
  • https://www.ziitek.com.vn/

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