Payment Terms | T/T |
Supply Ability | 100000pcs/day |
Delivery Time | 3-5 work days |
Packaging Details | 24*13*12cm cartons |
Products name | High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment |
Material | Carbon Fiber Filled Silicone |
Thermal Conductiivity | 9.0W/m-K |
Hardness | 55±10 Shore 00 |
Keywords | Thermal Pad |
Density | 2.1g/cc |
Operation Temperature | -40℃~ 200℃ |
Application | 5G Communication Equipment |
Brand Name | Ziitek |
Model Number | TIR700-09 |
Certification | UL and RoHs |
Place of Origin | Vietnam |
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Product Specification
Payment Terms | T/T | Supply Ability | 100000pcs/day |
Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
Products name | High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment | Material | Carbon Fiber Filled Silicone |
Thermal Conductiivity | 9.0W/m-K | Hardness | 55±10 Shore 00 |
Keywords | Thermal Pad | Density | 2.1g/cc |
Operation Temperature | -40℃~ 200℃ | Application | 5G Communication Equipment |
Brand Name | Ziitek | Model Number | TIR700-09 |
Certification | UL and RoHs | Place of Origin | Vietnam |
TIR700-09 High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment
TS-TIR®700-09 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.
Feature
> Good thermal conductivity 9.0W/mK
> Ultra-low thermal resistance
> Works under low pressure.
> Non-insulating material
> Non-adhesive surface
Application
> Between chips and heat dissipation modules
> 5G communication equipment
> Optoelectronics industry
> Wearable devices
Typical Properties of TIR®700-09 series | ||
Product Name | TIR®700-09 | Test Method |
Colour | Gray | Visual |
Construction | Carbon fiber filled silicone | ***** |
Thickness range | 0.04"~0.20"(1.0~5.0 mm) | ASTM D374 |
Hardness | 55±10 Shore 00 | ASTM D2240 |
Density | 2.1 g/cm3 | ASTM D792 |
Operation Temperature | -40℃~ 200℃ | ****** |
Thermal impedance | 9.0W/m-K | ASTM D5470 |
Specific heat capacity (J/g ℃) | 0.93 | ASTM E1269 @25℃ |
Flame Rating | V-0 | UL94 |
RoHS | Compliant | IEC62321 |
Product Specification
Standard Thickness:0.04" (1.0mm), 0.06" (1.5mm),0.08" (2.0mm),0.10" (2.5mm),0.12" (3.0mm)
Standard Size: 1.97”x 1.97”(50.0mm x 50.0mm)
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
200~500
Ecer Certification:
Verified Supplier
Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s... Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management s...
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