Shenzhen XinZhanHong Technology Co., Ltd.
| Packaging Details | 1.Inner: Vacuum packing or Anti-static package; 2.Outer: Standard export carton; 3.Customized package. |
| Supply Ability | 300000 Piece/Pieces per Month |
| Base Material | Aluminum Boards, FR-4 Glass Epoxy laminate, Aluminium base, RCC |
| Copper Thickness | 1-20oz |
| Board Thickness | 0.6-1.6MM |
| Min. Hole Size | 0.15MM |
| Min. Line Width | 0.15mm |
| Min. Line Spacing | 0.1MM |
| Surface Finishing | Immersion Silver |
| Product name | FPC |
| Product Range | PCBs in 1-28Layers,HDI,Aluminum Base |
| Max Board Size | 610*1200MM |
| Surface Finish Treatment | Immersion gold,Carbon Ink,Gold Fingers,Immersion Silver;Immersion Tin |
| Major Laminate | King Board,ShengYi(S1141; S1170),Arlon,YGA-1-1;Rogers and others |
| Via Holes | 18um 135um l 70um ~ 245um18um 1 35um l 70Oum ~ 210um |
| Min. Via Size and Type | Dia. 0.15mm (Finished);Aspect Ratio = 12; HDI holes (<0.10mm) |
| 100% Testing | by ICT/FCT to detect potential failures |
| PCB Design | schematic capture,reverse engineering |
| Port | Shenzhen |
| Model Number | XZH-PCB |
| Place of Origin | China |
| Brand Name | Original and New |
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Product Specification
| Packaging Details | 1.Inner: Vacuum packing or Anti-static package; 2.Outer: Standard export carton; 3.Customized package. |
Supply Ability | 300000 Piece/Pieces per Month |
| Base Material | Aluminum Boards, FR-4 Glass Epoxy laminate, Aluminium base, RCC | Copper Thickness | 1-20oz |
| Board Thickness | 0.6-1.6MM | Min. Hole Size | 0.15MM |
| Min. Line Width | 0.15mm | Min. Line Spacing | 0.1MM |
| Surface Finishing | Immersion Silver | Product name | FPC |
| Product Range | PCBs in 1-28Layers,HDI,Aluminum Base | Max Board Size | 610*1200MM |
| Surface Finish Treatment | Immersion gold,Carbon Ink,Gold Fingers,Immersion Silver;Immersion Tin | Major Laminate | King Board,ShengYi(S1141; S1170),Arlon,YGA-1-1;Rogers and others |
| Via Holes | 18um 135um l 70um ~ 245um18um 1 35um l 70Oum ~ 210um | Min. Via Size and Type | Dia. 0.15mm (Finished);Aspect Ratio = 12; HDI holes (<0.10mm) |
| 100% Testing | by ICT/FCT to detect potential failures | PCB Design | schematic capture,reverse engineering |
| Port | Shenzhen | Model Number | XZH-PCB |
| Place of Origin | China | Brand Name | Original and New |
| High Light | FPC PCB Assembly Services ，PCB Assembly Services Immersion Silver ，FPC Electronic PCB Assembly | ||
Shenzhen OEM Keyboard PCB Manufacturers Association PCBA Service for Aluminum Base
| Description | Technology & Capabilities | | | | | ||||
| 1. Product Range | Rigid PCBs from 2- 24 layers, HDI; Aluminium base | | | | | ||||
| 2. Min. Board Thickness | 2 layer | 4 layer | 6 layer | 8 layer | 10 layer | ||||
| | min. 0.2 mm | 0.4 mm | 1 mm | 1.2 mm | 1.5 mm | ||||
| | 12 & 14 layer | 16 layer | 18 layer | 20 layer | 22 & 24 layer | ||||
| | 1.6 mm | 1.7 mm | 1.8 mm | 2.2 mm | 2.6 mm | ||||
| 3. Max. Board Size | 610 x 1200 mm | | | | | ||||
| 4. Base Material | FR-4 Glass Epoxy laminate, Aluminium base, RCC | | | | | ||||
| 5. Surface Finish Treatment | Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic) | | | | | ||||
| 6. Major Laminate | King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others. | | | | | ||||
| 7. Via Holes | Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH | | | | | ||||
| 8. Copper Foil Thickness | 18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz) 18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz) | | | | | ||||
| 9. Min. Via Size and Type | Dia. 0.15mm (Finished). Aspect Ratiao = 12; HDI holes (＜0.10mm) | | | | | ||||
| 10. Min. Line Width & Spacing | 0.75 mm/ 0.10mm ( 3mil/ 4mil) | | | | | ||||
| 11. Min Via Hole Size & Pad | Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI＜0.10mm via | | | | | ||||
| 12. Impedance I Control Tol. | +/- 10% ( min. +/- 7 Ohm) | | | | | ||||
| 13. Solder Mask | Liquid Photo- Image (LPI) | | | | | ||||
| 14. Profiling | CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering | | | | | ||||
| 15. Capacity | 100 k㎡ output monthly | | | | | ||||
Company Details
Business Type:
Manufacturer
Year Established:
2014
Total Annual:
100000-5000000
Employee Number:
50~200
Ecer Certification：
Verified Supplier
Shenzhen XZH Technology Co., Ltd was found in 2014. The company is strong and professional technical, with a perfect quality assurance system and advanced test-analyzed instruments. Our factory is a professional manufacturer for PCB. which is widely applicable to consumer electronics, telecommuni... Shenzhen XZH Technology Co., Ltd was found in 2014. The company is strong and professional technical, with a perfect quality assurance system and advanced test-analyzed instruments. Our factory is a professional manufacturer for PCB. which is widely applicable to consumer electronics, telecommuni...
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