TOP Electronic Industry Co., Ltd.
| Payment Terms | T/T, Western Union,paypal |
| Supply Ability | 10kpcs/month |
| Delivery Time | 2-4 working days after receiving the payment |
| Packaging Details | 260pcs/tray |
| Product name | MCU Flash |
| Standard package | 260pcs/tray |
| Core Size | 32-bit |
| Program Memory Size | 32KB (32K x 8) |
| Program Memory Type | Flash |
| Number of I/O | 28 |
| Brand Name | NXP |
| Model Number | LPC1114FHN33/302:5 |
| Certification | CE,ROHS |
| Place of Origin | Taiwan |
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Product Specification
| Payment Terms | T/T, Western Union,paypal | Supply Ability | 10kpcs/month |
| Delivery Time | 2-4 working days after receiving the payment | Packaging Details | 260pcs/tray |
| Product name | MCU Flash | Standard package | 260pcs/tray |
| Core Size | 32-bit | Program Memory Size | 32KB (32K x 8) |
| Program Memory Type | Flash | Number of I/O | 28 |
| Brand Name | NXP | Model Number | LPC1114FHN33/302:5 |
| Certification | CE,ROHS | Place of Origin | Taiwan |
| High Light | electronic integrated circuits ，arm flash | ||
NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial
Description:
• System:
– ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.
– ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).
– Serial Wire Debug.
– System tick timer.
• Memory:
– On-chip flash programming memory for LPC1100, LPC1100L, and LPC1100C
series: 32 kB (LPC1114/LPC11C14), 24 kB (LPC1113), 16 kB
(LPC1112/LPC11C12), or 8 kB (LPC1111), 4kB (LPC1110).
– On-chip flash programming memory for LPC1100XL series: 8 kB (LPC1111), 16 kB
(LPC1112), 24 kB (LPC1113), 32 kB (LPC1114/203/303), 48 kB (LPC1114/323),
56 kB (LPC1114/333), 64 kB (LPC1115).
– 8 kB, 4 kB, 2 kB, or 1 kB SRAM.
– In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
– LPC1100XL series only: page erase IAP command.
• Digital peripherals:
– Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down
resistors. Number of GPIO pins is reduced for smaller packages and
LPC11C22/C24.
– GPIO pins can be used as edge and level sensitive interrupt sources.
– High-current output driver (20 mA) on one pin.
– High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.
– Four general purpose timers/counters with a total of four capture inputs and up to
13 match outputs.
– Programmable WatchDog Timer (WDT).
• Analog peripherals:
– 10-bit ADC with input multiplexing among up to 8 pins.
• Serial interfaces:
– UART with fractional baud rate generation, internal FIFO, and RS-485 support.
– Two SPI controllers with SSP features and with FIFO and multi-protocol
capabilities (second SPI on LQFP48 packages only).
– I
2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a
data rate of 1 Mbit/s with multiple address recognition and monitor mode.
– C_CAN controller (LPC11Cxx only). On-chip CAN and CANopen drivers included.
– On-chip, high-speed CAN transceiver (parts LPC11C22/C24 only).
• Clock generation:
– 12 MHz internal RC oscillator trimmed to 1% accuracy that can optionally be used
as a system clock.
– Crystal oscillator with an operating range of 1 MHz to 25 MHz.UM10398 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
User manual Rev. 12.3 — 10 June 2014 7 of 547
NXP Semiconductors UM10398
Chapter 1: LPC111x/LPC11Cxx Introductory information
– Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.
– PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
– Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, and the Watchdog clock.
• Power control:
– Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
– Power profiles residing in boot ROM allowing to optimize performance and
minimize power consumption for any given application through one simple function
call. (On LPC1100L and LPC1100XL parts only).
– Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
– Processor wake-up from Deep-sleep mode via a dedicated start logic using up to
13 of the functional pins.
– Power-On Reset (POR).
– Brownout detect with up to four separate thresholds for interrupt and forced reset.
• Unique device serial number for identification.
• Single 3.3 V power supply (1.8 V to 3.6 V).
• Available as LQFP48 package, HVQFN33 package.
• LPC1100L series also available as HVQFN24, TSSOP28 package, DIP28 package,
TSSOP20 package, and SO20 package.
• Available as dual-chip module consisting of the LPC1114 single-chip microcontroller
combined with a PCF8576D Universal LCD driver in a 100-pin LQFP package (part
LPC11D14FBD100/302).1
Specification:
| Standard package | 260pcs/tray |
| Category | Integrated Circuits (ICs) |
| Family | Embedded - Microcontrollers |
| Series | LPC1100L |
| Packaging | Tray |
| Core Processor | ARM® Cortex®-M0 |
| Core Size | 32-Bit |
| Speed | 50MHz |
| Connectivity | I²C, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, POR, WDT |
| Number of I/O | 28 |
| Program Memory Size | 32KB (32K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 8K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V |
| Data Converters | A/D 8x10b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 32-VQFN Exposed Pad |
| Supplier Device Package | 32-HVQFN (7x7) |
Ordering Information:
| Type number | Package | Description | Version |
| SO20, TSSOP20, TSSOP28, and DIP28 packages |
| ||
| LPC1110FD20 | SO20 | SO20: plastic small outline package; 20 leads; body width 7.5 mm | SOT163-1 |
| LPC1111FDH20/002 | TSSOP20 | TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm | SOT360-1 |
| LPC1112FD20/102 | SO20 | SO20: plastic small outline package; 20 leads; body width 7.5 mm width 4.4 mm | SOT163-1 |
| LPC1112FDH20/102 | TSSOP20 | TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm | SOT360-1 |
| LPC1112FDH28/102 | TSSOP28 | TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm | SOT361-1 |
| LPC1114FDH28/102 | TSSOP28 | TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm | SOT361-1 |
| LPC1114FN28/102 | DIP28 | DIP28: plastic dual in-line package; 28 leads (600 mil) | SOT117-1 |
| HVQFN24/33, LQFP48, and TFBGA48 packages |
| ||
| LPC1111FHN33/101 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/102 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111JHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/101 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/102 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN24/202 | HVQFN24 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm | SOT616-3 |
| LPC1112FHI33/102 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1112FHI33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1112FHI33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1112JHI33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1112FHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112JHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/301 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/302 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113JHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/301 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/302 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHI33/302 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHI33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1114JHI33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1114FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114JHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/333 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114JHN33/333 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FBD48/301 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1113FBD48/302 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1113FBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1113JBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/301 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/302 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114JBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/323 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114JBD48/323 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/333 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114JBD48/333 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1115FBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1115JBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1115FET48/303 | TFBGA48 | plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm | SOT1155-2 |
| LPC1115JET48/303 | TFBGA48 | plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm | SOT1155-2 |
Application:
it is used for a Wide range of fields :
Industrial products, communication etc
Product show:
Our advantage :
be sure to meet your need for all kinds of components. ^_^
Product List
Supply a Series of Electronic Components, full range of semiconductors, active & passive Components.We can help you to get all for bom of the PCB,IN a word, you can get one-stop solution here,
The offers including:
Integrated Circuit, Memory ICs, Diode, Transistor , Capacitor, Resistor, Varistor, Fuse, Trimmer & Potentiometer, Transformer, Battery, Cable, Relay, Switch, Connector, Terminal Block, Crystal & Oscillator, Inductor, Sensor, Transformer, IGBT Driver, LED,LCD, Convertor, PCB (Printed Circuit Board),PCBA (PCB Assembly)
Strong in Brand:
Microchip, MAX, AD, TI, NXP, ATMEL, ST, ON, NS, Intersil, Winbond, Vishay, ISSI, Infineon, NEC, FAIRCHILD, OMRON,YAGEO, TDK, etc
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
>10000000
Employee Number:
>20
Ecer Certification：
Verified Supplier
Thank you for your time to know our company and lean our production. TOP Electronic Industry co., Ltd was established in 2006. After 10 years effort and development, now we have become one of the leading electronic components distributors in China. We keep very kind relationship with our su... Thank you for your time to know our company and lean our production. TOP Electronic Industry co., Ltd was established in 2006. After 10 years effort and development, now we have become one of the leading electronic components distributors in China. We keep very kind relationship with our su...
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