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SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

  • China,Shenzhen
  • Verified Supplier

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China High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics
China High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics

  1. China High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics
  2. China High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics
  3. China High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics
  4. China High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics
  5. China High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics

High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics

  1. MOQ: 1pc
  2. Price: 1~999
  3. Get Latest Price
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Bond Strength High
Elongation 1% - 50%
Bonding Method Ultrasonic, Thermocompression, Thermosonic
Diameter 0.01mm - 0.4mm
Corrosion Resistance High
Application Semiconductor Packaging
Material Copper
Availability Custom sizes available
Brand Name WINNER
Model Number WCBW-2
Certification ISO 9001, ISO 14001, RoHS
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Western Union, L/C Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days. Packaging Details Roll, Neutrial Packing or with OEM LOGO
Bond Strength High Elongation 1% - 50%
Bonding Method Ultrasonic, Thermocompression, Thermosonic Diameter 0.01mm - 0.4mm
Corrosion Resistance High Application Semiconductor Packaging
Material Copper Availability Custom sizes available
Brand Name WINNER Model Number WCBW-2
Certification ISO 9001, ISO 14001, RoHS Place of Origin China
High Light 0.01 mm Bonding WireUltra Fine Wire Bonding WireElectronics Bonding Wire

High conductivity 0.01 mm Ultra Fine Wire Copper Bonding Wire for Electronics and Communications

Copper bonding wires are excellent for bonding in a ball / wedge process when using a reduced protective gas atmosphere. Cu wire bonding is also suitable for wedge / wedge bonding processes.
 
Description of Copper Bonding Wire
The Copper bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. The Copper bonding wire has the advantages of low price, good mechanical properties, and high electrical conductivity. Winner can provide Copper bonding wire with different wire diameters from 15um-50um according to customer requirements.
 
Characteristics
* High conductivity
* High tensile strength with high elongation
* Good loop stability
* Significantly reduced formation of intermetallic phases
* Very good ball formation under protective gas

 

 
Applications include:
* Computer : PC, Tablets, Servers & systems, Consumer
* Electronics : Smartphones & phones, TVs, Imaging devices, Wearable electronics
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
 
Dia EL(%) BL(gf)
mil um 4N 5N 4N 5N
WCBW-1 WCBW-2 WCBW-3 WCBW-4 WCBW-5 WCBW-6 WCBW-7 WCBW-8
0.6 15 3-15 3-15 3-16 3-17 >3.0 >3.0 >3.0 >3.0
0.7 18 3-17 3-17 3-18 4-19 >3.0 >3.0 >3.5 >4.0
0.8 20 4-18 4-18 4-19 5-20 >4.0 >4.5 >5.0 >5.0
0.9 23 6-20 6-20 6-21 6-22 >5.0 >6.0 >6.0 >6.5
1.0 25 8-22 8-23 8-24 8-24 >6.0 >7.0 >7.0 >8.0
1.2 30 9-23 9-24 9-25 9-26 >8.0 >8.5 >8.0 >10.0
1.3 33 9-24 10-25 10-26 10-27 >10.0 >11.0 >10.0 >12.0
1.5 38 10-25 10-26 10-27 11-28 >12.0 >12.0 >12.0 >14.0
1.7 43 10-26 11-28 10-30 11-30 >15.0 >16.0 >15.0 >18.0
2.0 50 12-28 12-30 12-32 12-34 >20.0 >20.0 >20.0 >20.0
 
 
The Advantages of Copper Bonding Wire Cost Savings
The relatively low cost of copper is one of the reasons for its appeal as an alternative interconnect material. By replacing gold wires with copper material, thus replacing the precious metal part, significant cost savings are possible. In applications that require increased wire diameters, the usage of copper bears a disproportionately high impact on the saving effect. Superior Performance of Copper Wires Copper exhibits significantly better conductivity than gold or aluminum. Therefore better heat dissipation and increased power ratings are attainable with thinner wire diameters. Copper possesses higher mechanical properties compared to gold. Therefore it displays excellent ball neck strength and high loop stability during molding or encapsulation.

 

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 0

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

 

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

 

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

 

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 1

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 2

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 3

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 4

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 5

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Trading Company,Seller

  • Year Established:

    2009

  • Total Annual:

    1000000-10000000

  • Employee Number:

    170~200

  • Ecer Certification:

    Verified Supplier

Since its foundation in 2009 in Sichuan Suining, Sichuan WINNER Special Electronic Materials Co., Ltd. has built a diversified range of business including research and development, production, and sales of semiconductor packaging materials.   As we focused on A Ultra-fine Coated Metal Wir... Since its foundation in 2009 in Sichuan Suining, Sichuan WINNER Special Electronic Materials Co., Ltd. has built a diversified range of business including research and development, production, and sales of semiconductor packaging materials.   As we focused on A Ultra-fine Coated Metal Wir...

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Get in touch with us

  • Reach Us
  • SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
  • B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
  • https://www.winneralloy.com/

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