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SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

  • China,Shenzhen
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Bonding Wire

Manufacturer of a wide range of products which include Silver Bonding Wire With Composite Material Treatment For Performance in Servers Systems,Higher Strength Level Beryllium Copper Conductor Material Wire with Excellent,Industri...

Quality Silver Bonding Wire With Composite Material Treatment For Performance in Servers Systems for sale

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Silver Bonding Wire With Composite Material Treatment For Performance in Servers Systems

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Diameter 18(0.7mil)
Breaking Load BL(gf) >4
Elongation EL(%) 3-20
Material Silver
Surface Finish Smooth
Application Semiconductor Packaging
Coating None
Purity 99.99%
Brand Name WINNER
Model Number YF-99
Certification ISO9001
Place of Origin China

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Quality Higher Strength Level Beryllium Copper Conductor Material Wire with Excellent for sale

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Higher Strength Level Beryllium Copper Conductor Material Wire with Excellent

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Tensile Strength ≥980MPa
Coating Material Ultra-fine Coating
Wire Diameter 0.01mm-0.4mm
Surface Treatment Polished
Elongation ≥1%
Conductor Material Beryllium Copper
Brand Name WINNER
Model Number WB-3
Certification ISO9001
Place of Origin China

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Quality Industrial Grade Beryllium Copper Wire 0.01mm-0.4mm In Metalworking And Joining for sale

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Industrial Grade Beryllium Copper Wire 0.01mm-0.4mm In Metalworking And Joining

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Tensile Strength ≥980MPa
Coating Material Ultra-fine Coating
Wire Diameter 0.01mm-0.4mm
Surface Treatment Polished
Elongation ≥1%
Conductor Material Beryllium Copper
Brand Name WINNER
Model Number WB-1
Certification ISO9001
Place of Origin China

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Quality Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding for sale

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Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Diameter 0.001mm - 0.05mm
Breaking Load BL(gf) >4
Elongation EL(%) 3-20
Wire Bonding Type Ball Bonding, Wedge Bonding, Ribbon Bonding
Material Aluminum
Application Semiconductor, Electronics, Medical Devices
Brand Name WINNER
Model Number WNE T10
Certification ISO9001
Place of Origin China

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Quality High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes for sale

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High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Density 19.34 g/cm3
Purity 99.99%
Material Gold
Tensile Strength 100 - 500 MPa
Bonding Method Ultrasonic, Thermocompression, Laser
Package Spool, Reel, Coil
Brand Name WINNER
Model Number WGBW-1
Certification ISO 9001, ISO 14001, RoHS
Place of Origin China

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Quality Ultra Fine Wire 0.01mm Diameter Gold Bonding Wire For Semiconductor Packaging for sale

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Ultra Fine Wire 0.01mm Diameter Gold Bonding Wire For Semiconductor Packaging

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Density 19.34 g/cm3
Purity 99.99%
Material Gold
Tensile Strength 100 - 500 MPa
Bonding Method Ultrasonic, Thermocompression, Laser
Temperature Range -40°C to 200°C
Package Spool, Reel, Coil
Melting Point 1063°C
Brand Name WINNER
Model Number WGBW-2
Certification ISO 9001, ISO 14001, RoHS
Place of Origin China

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Quality Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging for sale

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Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Bonding Method Ultrasonic, Thermocompression, Thermosonic
Diameter 0.01mm - 0.4mm
Material Copper
Package Weight 2.2 pounds
Product Type Bonding Wire
Application Semiconductor Packaging
Brand Name WINNER
Model Number WCBW-5
Certification ISO 9001, ISO 14001, RoHS
Place of Origin China

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Quality Composite Material Treated Silver Alloy Bonding Wire For ICLED Packaging for sale

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Composite Material Treated Silver Alloy Bonding Wire For ICLED Packaging

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Diameter 18(0.7mil)
Breaking Load BL(gf) >4
Elongation EL(%) 3-20
Material Silver
Application Semiconductor Packaging, LED Packaging, Automotive Electronics
Purity 99.99%
Melting Point 1064°C (Gold), 961°C (Silver), 1084°C (Copper)
Brand Name WINNER
Model Number YF-99
Certification ISO 9001, ISO 14001, RoHS
Place of Origin China

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Quality Premium Ultra Fine Wire Gold Bonding Wire for Advanced Electronic Bonding Applications for sale

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Premium Ultra Fine Wire Gold Bonding Wire for Advanced Electronic Bonding Applications

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Density 19.34 g/cm3
Purity 99.99%
Material Gold
Tensile Strength 100 - 500 MPa
Bonding Method Ultrasonic, Thermocompression, Laser
Temperature Range -40°C to 200°C
Package Spool, Reel, Coil
Melting Point 1063°C
Brand Name WINNER
Model Number WGBW-2
Certification ISO 9001, ISO 14001, RoHS
Place of Origin China

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Quality Semiconductor Electronics Aluminum Alloy Bonding Wire 6N High Purity 0.001mm-0.05mm for sale

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Semiconductor Electronics Aluminum Alloy Bonding Wire 6N High Purity 0.001mm-0.05mm

  1. MOQ: 1pc

  2. Price: 1~999

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 1000000 rolls per month
Delivery Time 5~8 working days.
Packaging Details Roll, Neutrial Packing or with OEM LOGO
Diameter 0.001mm - 0.05mm
Breaking Load BL(gf) >4
Elongation EL(%) 3-20
Wire Bonding Type Ball Bonding, Wedge Bonding, Ribbon Bonding
Package Spool, Reel, Coil
Material Aluminum
Application Semiconductor, Electronics, Medical Devices
Surface Finish Bright, Matte, Oxidized
Bonding Method Thermocompression, Ultrasonic, Laser
Brand Name WINNER
Model Number WNE T6
Certification ISO9001
Place of Origin China

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Get in touch with us

  • Reach Us
  • SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
  • B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
  • https://www.winneralloy.com/

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