Unicomp Technology
| Payment Terms | T/T, L/C |
| Supply Ability | 30 sets per month |
| Delivery Time | 30 days |
| Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Name | Unicomp Benchtop X Ray Machine |
| Application | SMT, EMS,BGA, Flip Chip , Semiconductor |
| Industry | Electronics Industry |
| X-ray Coverage | 48mm x 54mm |
| Spot Size | Spot Size |
| Power Consumption | 0.5kW |
| Brand Name | UNICOMP |
| Model Number | CX3000 |
| Certification | CE, FDA |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, L/C | Supply Ability | 30 sets per month |
| Delivery Time | 30 days | Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Name | Unicomp Benchtop X Ray Machine | Application | SMT, EMS,BGA, Flip Chip , Semiconductor |
| Industry | Electronics Industry | X-ray Coverage | 48mm x 54mm |
| Spot Size | Spot Size | Power Consumption | 0.5kW |
| Brand Name | UNICOMP | Model Number | CX3000 |
| Certification | CE, FDA | Place of Origin | China |
| High Light | desktop x ray machine ，x ray detector ，SMT Benchtop X Ray Machine | ||
Benchtop Electronics X-ray Machine for failure analysis laboratories
| Item | Definition | Specs |
| System Parameters | Size | 750(L)x570(W)x890(H)mm |
| Weight | 300kg | |
| Power | 220AC/50Hz | |
| Power Consumption | 0.5kW | |
| X-ray Tube | Type | Closed |
| Max.Voltage | 100kV | |
| Max.Power | 200μA | |
| Spot Size | 5μm | |
| Detector | Intensifier | FPD |
| X-ray Coverage | 48mm x 54mm | |
| Resolution | 208Lp/cm | |
| Work Station | Max.Loading Size | 200mm x 200mm |
| Max.Inspection Area | 200mm x 200mm | |
| Oblique Angle Views | 360° rotary fixture (Optional) | |
| X-ray Leakage | <1μSv/h | |
X-ray Inspecting Features:
(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.
(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.
(3) The test preparation time is greatly reduced.
(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.
(5) Double layers board and multi-layer boards only one check (with layered function).
(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.
Installation
Unicomp will provide installation and calibration service at the customers location Installation includes assistance in registering your new x-ray system with local and state agencies where applicable. One (1) on-site radiation survey at the time of installation with supporting documents.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2002
Total Annual:
60 Million-100 Million
Employee Number:
600~700
Ecer Certification：
Verified Supplier
X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intell... X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intell...
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