Unicomp Technology
| Supply Ability | 300 sets per month |
| Delivery Time | 30 days |
| Packaging Details | wooden case |
| Power supply | AC 110-220V |
| Warranty | 1 Year |
| Weight | 1150kg |
| Power Consumption | 0.8kW |
| X-ray Leakage | <1µSv/h |
| Brand Name | UNICOMP |
| Model Number | AX8200 |
| Certification | CE, FDA |
| Place of Origin | China |
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Product Specification
| Supply Ability | 300 sets per month | Delivery Time | 30 days |
| Packaging Details | wooden case | Power supply | AC 110-220V |
| Warranty | 1 Year | Weight | 1150kg |
| Power Consumption | 0.8kW | X-ray Leakage | <1µSv/h |
| Brand Name | UNICOMP | Model Number | AX8200 |
| Certification | CE, FDA | Place of Origin | China |
| High Light | electronics x ray system ，x ray equipment ，X Ray Flaw Screening Machine | ||
Electronics X Ray Machine for BGA , CSP , LED , Flip Chip , Semiconductor
OUR SERVICE
1. Your inquiry will be replied in 12 hours.
2. Original Manufacture to customers, with competitive price.
3. We provide one year warranty, free training and whole life technology support.
4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,
and will give you the tracking NO. after shipment.
5. Well-trained and Professional after-sales service team to support you.
6. Manual will package with machine . It will show you how to use machine step by step.
7. Items are only shipped after payment is received.
The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)
Application:
1. BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient
2.QFN:Bridging,Voids,Opens,Registration
3.SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
4.Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
5.Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias
Full Automatic BGA Testing Procedures
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output to Excel to facilitate review and archiving
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2002
Total Annual:
60 Million-100 Million
Employee Number:
600~700
Ecer Certification：
Verified Supplier
X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intell... X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intell...
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