Payment Terms | T/T |
Delivery Time | 13-15 working days |
Packaging Details | 400 mm x 200 mm |
Product Name | 8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink |
Composition | Ceramic Filler + Silicone |
Color | Pink |
Thickness | 0.5~10 mm |
Dielectric Constant | 7.2(@10mhz) |
Volume Resistivity | 1.0*10^12(Ω.cm) |
Thermal Conductivity | 8.0 W/m.K |
Brand Name | AOK |
Model Number | TP800 |
Certification | RoHS, Reach, UL |
Place of Origin | China |
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Product Specification
Payment Terms | T/T | Delivery Time | 13-15 working days |
Packaging Details | 400 mm x 200 mm | Product Name | 8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink |
Composition | Ceramic Filler + Silicone | Color | Pink |
Thickness | 0.5~10 mm | Dielectric Constant | 7.2(@10mhz) |
Volume Resistivity | 1.0*10^12(Ω.cm) | Thermal Conductivity | 8.0 W/m.K |
Brand Name | AOK | Model Number | TP800 |
Certification | RoHS, Reach, UL | Place of Origin | China |
High Light | Thermal Sheet CPU Silicone ,Silicone Thermal Sheet CPU ,Odorless Electrical Insulation Sheet Material |
Attribute | Value | Test Method |
---|---|---|
Composition | Ceramic Filler + Silicone | - |
Color | Pink | Visual |
Thickness(mm) | 0.5~10 | astm d374 |
Density(g/cc) | 3.35 | ASTM D792 |
Hardness(shore oo) | 55±10 | ASTM D2240 |
Usage Temperature(℃) | -40~150 | -- |
Electrical | ||
Breakdown Voltage(kv/mm) | >6.0 | ASTM D149 |
Dielectric Constant(@10mhz) | 7.2 | ASTM D150 |
Volume Resistivity(Ω.cm) | 1012 | ASTM D257 |
Flammability | V-0 | UL94 |
Thermal | ||
Thermal conductivity(W/m.K) | 8.0±0.5 | ASTM D5470 |
Product feature
■ Thermal conductivity:8.0 W/m.K
■ High thermal conductivity
■ The material is soft, with good compressibility, good thermal conductivity and insulation, and a large adjustable range of thickness. It is suitable for filling the cavity. Both sides have natural viscosity and strong operability and maintainability;
■ High electrical insulation
■ High compression rate
■ Low compression force
Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2004
Total Annual:
15000000-2000000
Employee Number:
150~300
Ecer Certification:
Active Member
Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif... Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif...
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