Payment Terms | T/T |
Delivery Time | 13-15 working days |
Packaging Details | 400 mm x 200mm |
Product Name | High Thermal Conductivity High Electrical Insulation Pink Thermal Pad Material |
Thermal conductivity | 8.0±0.5 W/m.K |
Composition | Ceramic Filler + Silicone |
Color | Pink |
Usage Temperature | -40 ℃~ 150 ℃ |
Flammability | V-0 |
Brand Name | AOK |
Model Number | TP |
Certification | RoHS, Reach, UL |
Place of Origin | China |
View Detail Information
Explore similar products
AOK Heat Transfer Thermal Pad Material Nontoxic Shockproof Practical
Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material
Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device
Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking
Product Specification
Payment Terms | T/T | Delivery Time | 13-15 working days |
Packaging Details | 400 mm x 200mm | Product Name | High Thermal Conductivity High Electrical Insulation Pink Thermal Pad Material |
Thermal conductivity | 8.0±0.5 W/m.K | Composition | Ceramic Filler + Silicone |
Color | Pink | Usage Temperature | -40 ℃~ 150 ℃ |
Flammability | V-0 | Brand Name | AOK |
Model Number | TP | Certification | RoHS, Reach, UL |
Place of Origin | China | ||
High Light | Durable GPU Heat Pads ,Multiscene GPU Heat Pads ,Anti Insulation Silicone CPU Pad |
High Thermal Conductivity High Electrical Insulation Pink Thermal Pad Material
Attribute | Value | Test Method |
---|---|---|
Composition | Ceramic Filler + Silicone | - |
Color | Pink | Visual |
Thickness(mm) | 0.5~10 | astm d374 |
Density(g/cc) | 3.35 | ASTM D792 |
Hardness(shore oo) | 55±10 | ASTM D2240 |
Usage Temperature(℃) | -40~150 | -- |
Electrical | ||
Breakdown Voltage(kv/mm) | >6.0 | ASTM D149 |
Dielectric Constant(@10mhz) | 7.2 | ASTM D150 |
Volume Resistivity(Ω.cm) | 1012 | ASTM D257 |
Flammability | V-0 | UL94 |
Thermal | ||
Thermal conductivity(W/m.K) | 8.0±0.5 | ASTM D5470 |
Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2004
Total Annual:
15000000-2000000
Employee Number:
150~300
Ecer Certification:
Active Member
Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif... Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif...
Get in touch with us
Leave a Message, we will call you back quickly!