Shenzhen Aochuan Technology Co., Ltd
| Payment Terms | T/T |
| Delivery Time | 13-15working days |
| Packaging Details | 400mmx200mm |
| Product Name | Ultra Soft Ceramic Filler Thermal Pad Material With 8.0w Thermal Conductivity |
| Composition | Ceramic Filler + Silicone |
| Thermal conductivity | 8.0±0.5（W/m.K） |
| Hardness | 55±10(Shore OO) |
| Usage Temperature | -40~150（℃） |
| Breakdown Voltage | ≥6.0（kv/mm） |
| Brand Name | AOK |
| Model Number | TP800 |
| Certification | RoHS, Reach, UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Delivery Time | 13-15working days |
| Packaging Details | 400mmx200mm | Product Name | Ultra Soft Ceramic Filler Thermal Pad Material With 8.0w Thermal Conductivity |
| Composition | Ceramic Filler + Silicone | Thermal conductivity | 8.0±0.5（W/m.K） |
| Hardness | 55±10(Shore OO) | Usage Temperature | -40~150（℃） |
| Breakdown Voltage | ≥6.0（kv/mm） | Brand Name | AOK |
| Model Number | TP800 | Certification | RoHS, Reach, UL |
| Place of Origin | China | ||
| High Light | Laptop GPU Thermal Pad Ultra Soft ，Anti Corrosion Laptop GPU Thermal Pad ，Tasteless Thermal Pad Electronics | ||
Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness(mm) | 0.5~10 | astm d374 |
| Density(g/cc) | 3.35 | ASTM D792 |
| Hardness(shore oo) | 55±10 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ＞6.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.2 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1012 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 8.0±0.5 | ASTM D5470 |
Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Purchase information:
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2004
Total Annual:
15000000-2000000
Employee Number:
150~300
Ecer Certification：
Active Member
Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif... Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif...
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