Shenzhen Aochuan Technology Co., Ltd
| Payment Terms | T/T |
| Delivery Time | 13-15working days |
| Packaging Details | 400mmx200mm |
| Tensile Strength(KN/m) | 2.5 |
| Elongation(%) | 60 |
| Usage Temperature(℃) | -40~150 |
| Product name | Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity |
| Density | 2.5(g/cc) |
| Hardness | 30±5(Shore OO) |
| Brand Name | AOK |
| Model Number | UTP100 |
| Certification | RoHS, Reach, UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Delivery Time | 13-15working days |
| Packaging Details | 400mmx200mm | Tensile Strength(KN/m) | 2.5 |
| Elongation(%) | 60 | Usage Temperature(℃) | -40~150 |
| Product name | Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity | Density | 2.5(g/cc) |
| Hardness | 30±5(Shore OO) | Brand Name | AOK |
| Model Number | UTP100 | Certification | RoHS, Reach, UL |
| Place of Origin | China | ||
| High Light | Multiscene Laptop CPU Thermal Pad ，Anti Interfere Laptop CPU Thermal Pad ，1W/m.K Thermal Cooling Pad Laptop | ||
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler, Silicone, and Reinforced Fiberglass | - |
| Color | White and Brick Red | Visual |
| Thickness(mm) | 0.5~12.0 | ASTM D374 |
| Density(g/cc) | 2.5 | ASTM D792 |
| Hardness(shore oo) | 30±5 | ASTM D2240 |
| Tensile Strength(KN/m) | 2.5 | ASTM D624 |
| Elongation(%) | 60 | ASTM D412 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 5.7 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 1.0±0.1 | ASTM D5470 |
Product feature:
■ Naturally tacky on one side
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%
■ because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;
■ with the addition of thermal silica gel, can make the contact surface between the heat source and the radiator better full contact, really do face to face contact. The reaction at temperature can achieve as small a temperature difference as possible;
Typical applications:
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs
Purchase information:
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2004
Total Annual:
15000000-2000000
Employee Number:
150~300
Ecer Certification：
Active Member
Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif... Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif...
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