Payment Terms | T/T |
Delivery Time | 13-15 working days |
Packaging Details | 400 mm x 200 mm |
Product name | Ultra Soft thermal pad 1.5 mm thickness silicone rubber adhesive cooling laptop thermal pad |
Composition | Reinforced Fiberglass |
Color | White |
Tensile Strength(KN/m) | 2.5 |
Density | 2.5 g/cc |
Hardness | 30±5(Shore OO) |
Brand Name | AOK |
Model Number | UTP100 |
Certification | RoHS, Reach, UL |
Place of Origin | China |
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Product Specification
Payment Terms | T/T | Delivery Time | 13-15 working days |
Packaging Details | 400 mm x 200 mm | Product name | Ultra Soft thermal pad 1.5 mm thickness silicone rubber adhesive cooling laptop thermal pad |
Composition | Reinforced Fiberglass | Color | White |
Tensile Strength(KN/m) | 2.5 | Density | 2.5 g/cc |
Hardness | 30±5(Shore OO) | Brand Name | AOK |
Model Number | UTP100 | Certification | RoHS, Reach, UL |
Place of Origin | China | ||
High Light | 2.5g/cc Ultra Soft Thermal Pad ,CPU Ultra Soft Thermal Pad ,heatproof Cooling Thermal Pad |
Attribute | Value | Test Method |
---|---|---|
Composition | Ceramic Filler, Silicone, and Reinforced Fiberglass | - |
Color | White and Brick Red | Visual |
Thickness(mm) | 0.5~12.0 | ASTM D374 |
Density(g/cc) | 2.5 | ASTM D792 |
Hardness(shore oo) | 30±5 | ASTM D2240 |
Tensile Strength(KN/m) | 2.5 | ASTM D624 |
Elongation(%) | 60 | ASTM D412 |
Usage Temperature(℃) | -40~150 | -- |
Electrical | ||
Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
Dielectric Constant(@10mhz) | 5.7 | ASTM D150 |
Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
Flammability | V-0 | UL94 |
Thermal | ||
Thermal conductivity(W/m.K) | 1.0±0.1 | ASTM D5470 |
Product feature:
■ the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ The thermal conductivity of the thermal silica gel sheet is adjustable and the thermal stability is better;
Typical applications:
■ Networking and Telecommunications
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ Consumer Electronics: Gaming Systems, and LCDs
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2004
Total Annual:
15000000-2000000
Employee Number:
150~300
Ecer Certification:
Active Member
Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif... Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif...
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