Payment Terms | T/T |
Delivery Time | 13-15 working days |
Packaging Details | 50 ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part) |
Product Name | 3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking |
Composition | Ceramic filler + Silicone |
Thermal conductivity | 3.0 W/m.K |
Viscosity/Component A | 400000 (cps) |
Viscosity/Component B | 400000 (cps) |
Hardness, after cure | 40 (shore oo) |
Brand Name | AOK |
Model Number | TF |
Certification | RoHS, Reach, UL |
Place of Origin | China |
View Detail Information
Explore similar products
Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler
Anticorrosive Thermal Liquid Gap Filler Anti Insulation Multipurpose
AOK Thermal Liquid Gap Filler Gel Heatproof Anti Insulation Durable
Multipurpose Thermal Liquid Gap Filler Anti Seismic
Product Specification
Payment Terms | T/T | Delivery Time | 13-15 working days |
Packaging Details | 50 ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part) | Product Name | 3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking |
Composition | Ceramic filler + Silicone | Thermal conductivity | 3.0 W/m.K |
Viscosity/Component A | 400000 (cps) | Viscosity/Component B | 400000 (cps) |
Hardness, after cure | 40 (shore oo) | Brand Name | AOK |
Model Number | TF | Certification | RoHS, Reach, UL |
Place of Origin | China | ||
High Light | Multiscene Thermal Conductive Filler ,Anti Aging Thermal Conductive Filler ,3W/m.K Liquid Thermal Gap Filler |
3.0W/m.K Thermal Conductivity Silica Gel Heat Transfer Liquid Gap Filler For Mobile Networking
Attribute | Value | Test Method |
---|---|---|
Composition | Ceramic filler + Silicone | - |
Color/Component A | White | Visual |
Color/Component B | Light Bule | Visual |
Density(g/cc) | 3 | ASTM D792 |
Usage Temperature(℃) | -40~150 | -- |
Electrical | ||
Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
Flammability | V-0 | UL94 |
Thermal | ||
Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
Viscosity/Component A (cps) | 400000 | ASTM D2196 |
Viscosity/Component B (cps) | 400000 | ASTM D2196 |
Hradness,after cure(shore OO) | 40 | ASTM D22240 |
Product feature
1. High thermal conductivity, low thermal resistance, excellent wetting
2. Soft, stress-free, infinitely compressed to a minimum of 0.1 mm
3. No settlement, no flow, can fill any uneven gap
4. Convenient design and application, with automatic glue machine can adjust any thickness size
Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)
Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour
Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2004
Total Annual:
15000000-2000000
Employee Number:
150~300
Ecer Certification:
Active Member
Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif... Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certif...
Get in touch with us
Leave a Message, we will call you back quickly!