Shenzhen Yideyi Technology Limited Company
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 100000/month |
| Delivery Time | 1-5 working days |
| Packaging Details | Anti-static bag + white pearl cotton (used around the inside of the carton) + carton |
| Name | Fan Outline Tolerance Double Sided PCB Assembly Mass-Production |
| Service | Double Sided PCB Assembly |
| Applied to | moblie phone,bluetooth,computer |
| Soldermask Bridge Width | 0.1mm(5mil) min./0.08mm(3mils) min. |
| Board Cutting | V-cut,Routing |
| Copper Weight | 0.2oz-10oz |
| Inner package | Vacuum packing |
| Material | FR4, Aluminum, FPC |
| Brand Name | YDY |
| Model Number | S-003 |
| Certification | ISO13485, IATF16949, ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram | Supply Ability | 100000/month |
| Delivery Time | 1-5 working days | Packaging Details | Anti-static bag + white pearl cotton (used around the inside of the carton) + carton |
| Name | Fan Outline Tolerance Double Sided PCB Assembly Mass-Production | Service | Double Sided PCB Assembly |
| Applied to | moblie phone,bluetooth,computer | Soldermask Bridge Width | 0.1mm(5mil) min./0.08mm(3mils) min. |
| Board Cutting | V-cut,Routing | Copper Weight | 0.2oz-10oz |
| Inner package | Vacuum packing | Material | FR4, Aluminum, FPC |
| Brand Name | YDY | Model Number | S-003 |
| Certification | ISO13485, IATF16949, ISO9001 | Place of Origin | China |
| High Light | Single Sided And Double Sided Pcb Assembly ，double sided pcb soldering ，Single sided two Sided PCBA | ||
Fan Outline Tolerance Double Sided PCB Assembly Mass-Production
Main Services:
Aoi Pcb Assembly
Low Volume PCB Production
Commercial management of the project.
Implementation of the firmware, IT management and programming.
Mechanical design,including design realization and 3D models.
Managing the documentation related to the finalization of the project.
PCB capability:
| Item | Specification | |
| 1 | Numbr of Layer | 1-16 Layers (standard) |
| 2 | Material | FR4, Aluminum, FPC |
| 3 | Surface Finish | HASL(LF), Gold plating, Enig,Immersion gold, Immersion Tin, OSP |
| 4 | Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
| 5 | Copper Thickness | 1/2 oz min;12 oz max |
| 6 | Solder Mask | Green/Black/White/Red/Blue/Yellow |
| 7 | Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| 8 | Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
| 9 | Min.Hole Diameter for punching | 0.9mm(35mil) |
| 10 | Biggest panel size | 610mm*508mm |
| 11 | Hole Positon | +/-0.075mm(3mil) CNC Driling |
| 12 | Conductor Width(W) | 0.05mm(2mil)or;+/-20% of original artwork |
| 13 | Hole Diameter(H) | PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil) |
| 14 | Outline Tolerance | 0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching |
| 15 | Warp & Twist | 0.70% |
| 16 | Insulation Resistance | 10Kohm-20Mohm |
| 17 | Conductivity | <50ohm |
| 18 | Test Voltage | 10-300V |
| 19 | Panel Size | 110×100mm(min);660×600mm(max) |
| 20 | Layer-layer misregistration | 4 layers:0.15mm(6mil)max;6 layers:0.25mm(10mil)max |
| 21 | Min.spacing between hole edge to circuity pattern of an inner layer | 0.25mm(10mil) |
| 22 | Min.spacing between board ouline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| 23 | Board thickness tolerance | 4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil) |
| 24 | Impedance Control | +/-10% |