Shenzhen Yideyi Technology Limited Company
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 30000pcs/month |
| Delivery Time | 1-20 working days |
| Packaging Details | Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement. |
| Service | PCB components sourcing assembly test package |
| Type | High Speeds THT DIP PCBA Multilayer PCB Assembly Through Hole Pcb Assembly. |
| Color | Green,Customized Color,Blue on your request |
| Copper thickness | 0.5oz-4oz |
| Layer | 1~60 layers |
| Pcb assembly process | SMT THT DIP,DIP. SMT PCB Assembly |
| Surface finishing | HASL,OSP,ENIG,HASL Lead Free,immersion gold |
| MOQ | No |
| Brand Name | YDY |
| Model Number | TP12 |
| Certification | ISO13485, IATF16949, ISO9001,IOS14001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram | Supply Ability | 30000pcs/month |
| Delivery Time | 1-20 working days | Packaging Details | Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement. |
| Service | PCB components sourcing assembly test package | Type | High Speeds THT DIP PCBA Multilayer PCB Assembly Through Hole Pcb Assembly. |
| Color | Green,Customized Color,Blue on your request | Copper thickness | 0.5oz-4oz |
| Layer | 1~60 layers | Pcb assembly process | SMT THT DIP,DIP. SMT PCB Assembly |
| Surface finishing | HASL,OSP,ENIG,HASL Lead Free,immersion gold | MOQ | No |
| Brand Name | YDY | Model Number | TP12 |
| Certification | ISO13485, IATF16949, ISO9001,IOS14001 | Place of Origin | China |
| High Light | Through Hole Aluminum Pcb ，Through Hole Circuit Board ，Thru Through Hole Component Assembly | ||
High Speeds THT DIP PCBA Multilayer PCB Assembly Through Hole Pcb Assembly.
YDYPCBA service include :
SMT, Through-hole & Mixed Technology , Single & Double Sided SMT Assembly
Leaded & Lead Free (RoHS) Assembly
No-Clean & Water Soluble Fluxes
Standard Flux: Water Soluble
PCBA Testing Services
Conformal Coating
Rework Services
SMT Sizes: 0201 or greater
BGA Pitch: 16 mil (0.4mm) or greater
Fine Pitch: 16 mil (0.4mm) or greater
Ball Grid Array (BGA & µBGA), QFN, POP &
lead-less chips
Wire & Cable Harnesses
Class II and Class III Inspection
Visual, Automatic Optical & X-ray Inspection
Box Build
Through-hole assembly provides a more robust mechanical bond between the circuit board and the application. Enhanced strength and security make through-hole assembly the preferred option for manufacturers in aerospace and military sectors.
PCB Manufacture Capacity
| Service type | High Speeds THT DIP PCBA Multilayer PCB Assembly Through Hole Pcb Assembly. |
| Material | HAL(with Pb free),plated Ni/Au, Immersion silver,Imm Ni/Au,Imm Sn, hard gold,OSP,ect |
| Surface Finish | HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) |
| Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
| Min.board thickness(multilayer) | 4layers:0.4mm; 6layers:0.6mm; 8layers:1mm; 10layers:1.2mm |
| Copper Thickness | 1/2 oz min;12 oz max |
| Solder Mask | Green/Black/White/Red/Blue/Yellow |
| Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min.Hole Diameter for punching | 0.9mm(35mil) |
| Biggest panel size | 610mm*508mm |
| Hole Positon | +/-0.075mm(3mil) CNC Driling |
| Conductor Width(W) | 0.05mm(2mil)or; +/-20% of original artwork |
| Hole Diameter(H) | PTH L:+/-0.075mm(3mil); Non-PTH L:+/-0.05mm(2mil) |
| Outline Tolerance | 0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110×100mm(min);660×600mm(max) |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max |
| Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
| Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil) |
| Impedance Control | +/-10% |
Through Hole Technology Process Steps
Component placement: For THT, the component leads or pins are inserted through the board.
Inspection and correction: Any errors in placement will be corrected here.
Wave soldering: For wave soldering, one side of the entire board is exposed to a “wave” of solder. As the board traverses the wave, the through-hole components are soldered simultaneously.
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, TS 16949, UL
We provide through-hole PCB assembly services to meet conventional lead assembly requirements of a variety of industries. We provide single, double-sided, and high-density multilayer PCB Through Hole (PTH) circuit board assembly services to meet our clients’low to mid-volume production requirements.
Company Details
Business Type:
Manufacturer
Year Established:
2018
Total Annual:
5500,000-8000,000
Employee Number:
400~500
Ecer Certification：
Active Member
In 2019, YDY Technology marked our 20th anniversary of providing high quality PCB and PCBA service to the electronics industry. YDY has professional team to offer flexible one stop solution for your PCBA projects, including PCB design, components procurement, PCB Assembly, Box building, functional t... In 2019, YDY Technology marked our 20th anniversary of providing high quality PCB and PCBA service to the electronics industry. YDY has professional team to offer flexible one stop solution for your PCBA projects, including PCB design, components procurement, PCB Assembly, Box building, functional t...
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