Shenzhen Yideyi Technology Limited Company
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 150000 Pieces per Month |
| Delivery Time | 1-5 working days |
| Packaging Details | PCB: Vacuum Packing/ PCBA: ESD Packing |
| Name | LED Flexible PCB Strip Flexible PCBs circuit Board |
| Base Copper Thicknessg | 1/3 Oz To 8oz |
| Min Hole Size(diameter) | >=0.35mm |
| Base material | PI, PET, Electrolytic Copper, Rolled Copper |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Number Of Layers | 1-8 Layer |
| Surface Finish | Immersion Gold,OSP,Immersion Silver,Immersioni Tin |
| Stiffener | FR4/PI/PET/SUS/PSA |
| Brand Name | YDY |
| Model Number | F-001 |
| Certification | ISO13485, IATF16949, ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram | Supply Ability | 150000 Pieces per Month |
| Delivery Time | 1-5 working days | Packaging Details | PCB: Vacuum Packing/ PCBA: ESD Packing |
| Name | LED Flexible PCB Strip Flexible PCBs circuit Board | Base Copper Thicknessg | 1/3 Oz To 8oz |
| Min Hole Size(diameter) | >=0.35mm | Base material | PI, PET, Electrolytic Copper, Rolled Copper |
| Min.Line Width/Spacing | 0.04mm/0.04mm | Number Of Layers | 1-8 Layer |
| Surface Finish | Immersion Gold,OSP,Immersion Silver,Immersioni Tin | Stiffener | FR4/PI/PET/SUS/PSA |
| Brand Name | YDY | Model Number | F-001 |
| Certification | ISO13485, IATF16949, ISO9001 | Place of Origin | China |
| High Light | Flexible Pcb For Led Strip ，eagle flexible pcb ，flexible pcb eagle cad | ||
LED Flexible PCB Strip Flexible PCBs circuit Board copying
Flexible circuits (also variously referred to around the globe as flex circuits, flexible printed circuit boards, flex print, Flexi-circuits) are members of electronic and interconnection family. They consist of a thin insulating polymer film having conductive circuit patterns affixed thereto and typically supplied with a thin polymer coating to protect the conductor circuits. The technology has been used for interconnecting electronic devices since the 1950s in one form or another. It is now one of the most important interconnection technologies in use for the manufacture of many of today's most advanced electronic products.
FPC Capability
Advantages
(1) It can be freely bent, wound, folded, can be arranged arbitrarily according to the spatial layout requirements, and can be arbitrarily moved and expanded in three-dimensional space, thereby achieving integration of component assembly and wire connection.
(2) The use of FPC can greatly reduce the size and weight of electronic products, and is suitable for the development of electronic products in the direction of high density, miniaturization, and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDA, digital cameras and other fields or products.
(3) FPC also has the advantages of good heat dissipation and solderability, easy assembly, and low cost. The design of soft and hard combination makes up for the slight shortage of flexible substrate in the bearing capacity of components.
Thsse benefits make flex PCBs ideally fit for a wide range of applications in industries such as Military, Transportation, Medical, Consumer Electronics, Automotive, Aerospace, Communications and Industrial.
The Basic Structure of FPCB
Based on the analysis of the basic structure of the FPCB, it is found that the materials that make up the FPCB are insulating substrate, adhesive, metal conductive layer (copper foil) and covering layer.
1 Copper Film
(1) Copper foil: basically divided into the electrolytic copper and the rolled copper. The common thickness is 1oz 1/2oz and 1/3oz.
(2) Substrate film: the common thickness is 1mil and 1/2mil
(3) Glue (adhesive): the thickness is determined according to the requirements of the customer.
2 Cover Film
(1) Cover Film: for surface insulation. The common thickness is 1 mil and 1/2 mil.
(2) Glue (adhesive): the thickness is determined according to the requirements of the customer.
(3) Release paper: avoid the adhesive adhering to foreign objects before pressing, and make it easy to operate.
3 PI Stiffener Film
(1) PI Stiffener Film: stiffener the mechanical strength of FPC to facilitate surface mounting operation. The common thickness ranges from 3 mil to 9 mil.
(2 )Glue (adhesive): the thickness is determined according to the requirements of the customer.
(3) EMI: electromagnetic shielding film, which protects the circuit board from external interference (strong electromagnetic area or susceptible area).
Company Details
Business Type:
Manufacturer
Year Established:
2018
Total Annual:
5500,000-8000,000
Employee Number:
400~500
Ecer Certification：
Active Member
In 2019, YDY Technology marked our 20th anniversary of providing high quality PCB and PCBA service to the electronics industry. YDY has professional team to offer flexible one stop solution for your PCBA projects, including PCB design, components procurement, PCB Assembly, Box building, functional t... In 2019, YDY Technology marked our 20th anniversary of providing high quality PCB and PCBA service to the electronics industry. YDY has professional team to offer flexible one stop solution for your PCBA projects, including PCB design, components procurement, PCB Assembly, Box building, functional t...
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