HASL 12 Layer Multilayer Printed Circuit Board Assembly Manufacturer

Shenzhen Yideyi Technology Co., Ltd  founded in 2008, It's an industry leading producing and R&D manufacturer in silk screen printing, gift and electronic areas with deep domain expertise and best service to help clients get high-quality and competitive products with 13 years history. Based on our professional and innovative technologies, we produce membrane switch, flexible circuit, membrane panel, lens, crystal epoxy, adhesive sticker, name plate and so on. In addition, there is an electronic department to produce various electronic products (eg. writing tablet, air purifier, mosquito killer, keyboards, Bluetooth speaker etc).

There are more than 500 staffs in our factory with a variety of sophisticated high-end modern equipments, like all-auto silk-screen printer, semi-auto silk screen printer (15 sets), six-color printer, CNC engraving machine (25 sets), digital control cutting machines, laser cutter, injection molding machine, punching machine, etc.

We also have dust-free workshop and labs, etc. There are many testing equipments in the labs, like binary tester,high and low temperature tester, tension tester, height tester, membrane switch life tester, membrane switch lead tester, etc. After several years' development and advancement, we've gained many achievements and certifications. Our company has passed ISO 9001:2008, ISO 14001:2004, OHSAS18001:2007, UL, SGS, TUV quality management system certification and other related product certifications (CE, FCC, RoHS, CCC, ASTM F963-16, etc). 
We attach great importance to win-win cooperation and focus on winning more value for our clients. "Continuous improving and serve for you with all sincerity" is our service tenet. You support is our developing dynamic and welcome your visit and guidance.

Manufacturing Multilayer PCBs (Up to 40 Layers)

The demand for multilayer printed circuit boards has been on the rise. The drive for electronics to be smaller, faster, and more powerful has made the multilayer PCB much more popular. The ability to create multilayer boards opens up a world of possibilities allowing the engineer to create more densely populated circuit boards which allows miniaturization. This is a huge benefit that double sided boards are not able to offer.

The First Process in the Production of a Multilayer PCB is Making the Inner Layer Core

The process begins by selecting a sheet of laminate that is the correct thickness and covered with Cu foil of the required weight. Both Sides of the core are covered with a UV sensitive, dry film resist that is “hot-roll” laminated in place. Using film created from the electronic data, the inner layer circuitry and planes are transferred to the resist.

The clear areas of the film allow the UV light to make contact with the resist, hardening it so it will adhere to the core surface. The resist that is protected from the light will be developed away in the next process. Developing off the resist exposes the Cu areas that will be removed from the core’s surface.

Materials used in the lamination process include: inner layer core, sheets of “prepreg” (woven glass cloth with epoxy resin), and sheets of Cu foil. Tooling holes in each sheet of materials and core are used to align them as they are stacked up. For a 4 layer board, the bottom would be a sheet of foil, followed by a specific number of sheets of prepreg, the the inner layer core. It is followed by more prepreg and finally the top sheet of foil. The stack of panels is built on a heavy metal plate and when it is completed a top plate is added creating a “book”. The book is then moved to a heated hydraulic press.

Pressure, heat, and a vacuum are applied over a 2 hour period forcing the resin from the prepreg to become elastic and flow across the core and foil surfaces. Once cured, the resin will join the glass sheets, core, and foil together into the multilayer PCB pannel.

Our service

1. SMT service;

2. Design service, Gerber drawings;

3. Good quality and fast delivery with lower price than double side PCB.

4. Specifications of LEAD Free HASL 1 Layer / Single Side Rigid PCB/PCBA:

1) Base material: FR-1(94v0), FR-4, CEM-1,

2) Max Board size: 600*600mm

3) Board thickness: 0.2mm/0.6mm/0.8mm/1.2mm/1.6mm/3.2mm

4) Copper thickness: 0.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz

5) Special tech: BGA, PTH, Blind and buried vias

6) Profile: V-scoring, V-cutting, punching, etching, milling, routing

7) Surface treatment: HASL, OS, Immersion gold, gold plated (coating)

8) With best price to USA, South American, India, South Africa and Europe

9) Main market: USA, EGYPT, Europe, South American, mid-east

10) Compliant: UL, ROHS, ISO9001-2000

11) Standard: IPC-A-600F, IPC-D-300G, MIL-STD-105D LEVEL II

12) Application: Home appliances, electronics, digital camera, LCD TV sets, medical equipments, telecommunication, LED lightings, street light, mobile phone, computer, laptop test equipment and power meter, electrical weighing scale, night

13) Small quantity and prototypes acceptable

14) Lead time: 5-7days for prototypes, 9-13days for mass production

15) Available Service: OEM, 24hrs service for fast prototype

Our Advantages:

• Supply OEM/ODM and custom service
• High quality with smart balance function
• Wholesale price
• ISO9001/ISO14001/CE/ROHS certificates
• Fast delivery
• Green product
• One year warranty
• Excellent safety performance
• Short circuit testing passed
• Overcharge testing passed
• Over discharge testing passed
• Original imported :IC from Japan,MOS from USA,Components from Sumsang.
• 1.2m drop testing passed
• 100% testing
• Support ODM & OEM services

SMT Production processes:

Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

PCB Assembly Manufacturing Procedures:

Program Management

PCB Files → DCC → Program Organizing → Optimization → Checking

SMT Management

PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping

PCBA Management

THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment

Files Requested For Quote:

In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information:

1. Gerber file,PCB file,Eagle file or CAD file are all acceptable

2. A detailed bill of materials (BOM)

3. Clear pictures of PCB or PCBA sample for us

4. Quantity and delivery required

5. Test method for PCBA to guarantee 100% good quality products.

6. Schematics file for PCB design if need to do function test.

7. A sample if available for better sourcing

8. CAD files for enclosure manufacturing if required

9. A complete wiring and assembly drawing showing any special assembly instructions if required

PCB Capability