Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad |
| Thinkness range | 0.020"(0.50mm)~0.200"(5.00mm) |
| Keywords | Silicone Thermal Pad |
| Hardness | 20 Shore 00 |
| Thermal Conductivity | 6.5W/mK |
| Color | Gray |
| Flam rating | 94 V-0 |
| Density | 3.3g/cc |
| Application | Electronics Cooling |
| Brand Name | Ziitek |
| Model Number | TIF100 6520-11 |
| Certification | UL & RoHS |
| Place of Origin | China |
View Detail Information
Explore similar products
3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices
High Hardness Heat Sink Thermal Pad 2.0mmt For Automotive Electronics
3.0mmt Heat Sink Thermal Pad Ceramic Filled Silicone Elastomer For Routers
High Conductivity 6W/MK Heat Sink Thermal Pad For Vehicle Camera
Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad | Thinkness range | 0.020"(0.50mm)~0.200"(5.00mm) |
| Keywords | Silicone Thermal Pad | Hardness | 20 Shore 00 |
| Thermal Conductivity | 6.5W/mK | Color | Gray |
| Flam rating | 94 V-0 | Density | 3.3g/cc |
| Application | Electronics Cooling | Brand Name | Ziitek |
| Model Number | TIF100 6520-11 | Certification | UL & RoHS |
| Place of Origin | China |
High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad
Company Profile
ZiitekZiitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
TIF®100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling efficient heat tansfer from discrete components or the entire PCB to the metal housing or heat sink ,This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.
Features:
> Excellent thermal conductivity 6.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU And GPU processors and other chipsets
> Display card
> Mainboard/mother board
> Memory Modules
> Audio and video components
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
| Typical Properties of TIF®100 6520-11 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.3g/cc | ASTM D297 |
| thickness | 0.020"(0.50mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 20 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5000 VAC | ASTM D149 |
| Dielectric Constant | 6.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 6.5W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
Get in touch with us
Leave a Message, we will call you back quickly!