Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad |
| Color | Gray |
| Flam rating | 94V0 |
| Thermal Conductivity | 8.0 W/mK |
| Thinkness range | 0.012"(0.30mm)~0.200"(5.00mm) |
| Keywords | Silicone Thermal Pad |
| Hardness | 45 Shore 00 |
| Application | CPU And Power Devices |
| Brand Name | Ziitek |
| Model Number | TIF100C 8045-11 |
| Certification | RoHS and UL recognized |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad | Color | Gray |
| Flam rating | 94V0 | Thermal Conductivity | 8.0 W/mK |
| Thinkness range | 0.012"(0.30mm)~0.200"(5.00mm) | Keywords | Silicone Thermal Pad |
| Hardness | 45 Shore 00 | Application | CPU And Power Devices |
| Brand Name | Ziitek | Model Number | TIF100C 8045-11 |
| Certification | RoHS and UL recognized | Place of Origin | China |
| High Light | Power Devices Silicone Heat-Conducting Pad ，CPU Silicone Heat-Conducting Pad ，High Thermal Conductivity Silicone Pad | ||
High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.
Features:
>Excellent thermal conductivity 8.0W/mK
>Self-adhesive without the need for additional surface adhesive
>Highly compressible, soft, and elastic
>Available in various thicknesses
>Good chemical stability
Applications:
>CPU and GPU processors and other chipsets
>High-performance computing (HPC)
>Industrial equipment
>Network communication devices
>New energy vehicles
| Typical Properties of TS-TIF®100C 8045-11 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.4g/cc | ASTM D297 |
| thickness | 0.012"(0.30mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 45 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 7.2MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 8.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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