Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 100000can/month |
| Delivery Time | 3-7 work days |
| Packaging Details | 1kg/can |
| Name | One Componen Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive |
| Usage | Potting glue |
| Thermal conductivity | 1.0W/MK |
| Keyword | Thermally Conductive Silicone Adhesive |
| Feature | Low shrinkage adn low viscosity |
| Color | White paster |
| Hardness | 45 Shore A |
| Application | LED lamps and power-driven potting |
| Brand Name | Ziitek |
| Model Number | TIS580-10 |
| Certification | RoHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 100000can/month |
| Delivery Time | 3-7 work days | Packaging Details | 1kg/can |
| Name | One Componen Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive | Usage | Potting glue |
| Thermal conductivity | 1.0W/MK | Keyword | Thermally Conductive Silicone Adhesive |
| Feature | Low shrinkage adn low viscosity | Color | White paster |
| Hardness | 45 Shore A | Application | LED lamps and power-driven potting |
| Brand Name | Ziitek | Model Number | TIS580-10 |
| Certification | RoHS | Place of Origin | China |
| High Light | One Componen Thermally Conductive Silicone Adhesive ，Dealcoholized Thermally Conductive Silicone Adhesive | ||
One Componen Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive
TIS™580-10 Series is dealcoholized,one component, room temperature cure thermally conductive silicone adhesive. lt possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance.Thus, heat transfer among heat source, heat-sink, motherboard,metal casing will become effective.
TIS™580-10 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.TIS™580-10 Series has excellent adhesion to copper, aluminium, stainless-steel,etc.As this is a dealcoholized system, it will not corrode, especially, metalsurfaces.
Feature
> Good thermal conductive: 1.0W/mK
> Excellent maneuverability and good adhesion
> Low shrinkage
> Low viscosity, Leads to void-free surface
> Good solvent resistance ,water resistance
> Long working life
> Excellent thermal shock resistance
Application
lt mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-10,resulting a more reliable gap-filling thermal conduction,simplified handling and more cost-effective.E.g. Massive application in integrated circuits in portable computer, microprocessor, highpower LED, internal storage module, cache,integrated circuits, DCIAC translator,IGBT and other power modules, encapsulation of semi-conductors,relay switches, rectifiers and transfomers.
| Typical values of TIS™580-10 | ||
| Appearance | White paste | Test Method |
| Density ( g/cm³,25℃) | 1.3 | ASTM D297 |
| Tack-free time ( min,25℃ | ≤20 | ******** |
| Cure type ( 1-component) | Dealcoholized | ******** |
| viscosity@25℃ Brookfield (Uncured) | 30K cps | ASTM D1084 |
| Total cure time( d,25℃) | 3-7 | ******** |
| Elongation ( %) | ≥200 | ASTM D412 |
| Hardness ( Shore A) | 45 | ASTM D2240 |
| Lap Shear Strength( MPa) | ≥2.5 | ASTMD1876 |
| Peel Strength (N/mm ) | >5 | ASTM D1876 |
| Operation temperature ( ℃ ) | -60~250 | ******** |
| Volume Resistivity ( Q-cm ) | 2.0×10 | ASTM D257 |
| Dielectric Strength ( KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m-K) | 1 | ASTM D5470 |
| Flame Retardancy | UL94V-0 | E331100 |
Packing:
100ml / pc,100pc / box; 300ml / pc, 24pc / box
Storage and transportation:
1.Store in cool, dry place. Shelf life: 6 months (25℃)
2.This product is non-hazardous, refers to local general chemical transportation regulation
Company profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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