Dongguan Ziitek Electronical Material and Technology Ltd.
Payment Terms | T/T |
Supply Ability | 1000000 pcs/month |
Delivery Time | 3-5 work days |
Packaging Details | 24*13*12cm cartons |
Product name | Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu |
Thickness | 1.5mmT |
Keywords | Thermal pad |
Specific Gravity | 2.3g/cc |
Dielectric Breakdown Voltage | >5500 VAC |
Thermal conductivity | 1.5W/m-K |
Color | Black |
Sample | Sample available |
Application | Electronic Component Gap Filling |
Brand Name | Ziitek |
Model Number | TIF100-01E |
Certification | UL & RoHS |
Place of Origin | China |
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Product Specification
Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
Product name | Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu | Thickness | 1.5mmT |
Keywords | Thermal pad | Specific Gravity | 2.3g/cc |
Dielectric Breakdown Voltage | >5500 VAC | Thermal conductivity | 1.5W/m-K |
Color | Black | Sample | Sample available |
Application | Electronic Component Gap Filling | Brand Name | Ziitek |
Model Number | TIF100-01E | Certification | UL & RoHS |
Place of Origin | China | ||
High Light | 1.5W/M-K Thermal Conductive Pad ,Thermal Conductive Pad 45 Shore 00 ,94 V0 thermal gap pad |
Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
The TIF160-06E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance
> Electrically isolating
Applications
> display card
> mainboard/mother board
> notebook
> power supply
> CPU
> Memory Modules
> routers
> Telecommunication hardware
> mainboard/mother board
> IT infrastructure
> Automotive electronics
Typical Properties of TIF100-66U Series | ||
Property | Value | Test method |
Color | Black | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Density | 2.3g/cm³ | ASTM D297 |
Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ****** |
Hardness | 35 Shore 00 | ASTM 2240 |
Continuos Use Temp | -45 to 200℃ | ****** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 4.7 MHz | ASTM D150 |
Volume Resistivity(Ohm-cm) | 1.0X1012 | ASTM D257 |
Fire rating | 94 V0 | UL equivalent |
Thermal conductivity | 1.5W/m-K | ASTM D5470 |
Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
Individual die cut shapes and custom thickness can be supplied.
Please contact us of confirming.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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