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Dongguan Ziitek Electronic Materials & Technology Ltd.

  • China,Dongguan ,Guangdong
  • Verified Supplier

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China Thermally Conductive One Component Silicone Adhesive for Room Temperature Curing
China Thermally Conductive One Component Silicone Adhesive for Room Temperature Curing

  1. China Thermally Conductive One Component Silicone Adhesive for Room Temperature Curing
  2. China Thermally Conductive One Component Silicone Adhesive for Room Temperature Curing

Thermally Conductive One Component Silicone Adhesive for Room Temperature Curing

  1. MOQ: 25PC
  2. Price:
  3. Get Latest Price
Supply Ability 1000PC/Day
Delivery Time 2-3 work days
Packaging Details 300ml/1PC
Products name One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive
Appearance White paste
Density(g/cm3,25℃) 1.3
Operation temperature -60~250℃
Keywords Thermally Conductive Silicone Adhesive
Hardness(Shore A) 25
Thermal Conductivity 1.2W/(m·K)
Brand Name ziitek
Model Number TIS580-12
Certification RoHs
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Supply Ability 1000PC/Day Delivery Time 2-3 work days
Packaging Details 300ml/1PC Products name One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive
Appearance White paste Density(g/cm3,25℃) 1.3
Operation temperature -60~250℃ Keywords Thermally Conductive Silicone Adhesive
Hardness(Shore A) 25 Thermal Conductivity 1.2W/(m·K)
Brand Name ziitek Model Number TIS580-12
Certification RoHs Place of Origin China
High Light Thermally Conductive Silicone AdhesiveRoom Temperature Curing Silicone AdhesiveOne Component Silicone Adhesive

One Component Dealcoholized Room Temperature cured Thermally Conductive Silicone Adhesive

TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.

 

TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.

TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

 

TIS580-12 Series Datasheet-(E)-REV01.pdf

Feature

 
Good thermal conductivity: 1.2W/mK
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Longer working life
Excellent thermal shock resistance

 
Application
 
It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-13, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
 
Typical values of TISTM580-12
Appearance White paste Test Method
Density(g/cm3,25℃) 1.2 ASTM D297
Tack-free time(min,25℃) ≤20 *****
Cure type(1-component) Dealcoholized *****
Viscosity@25℃ Brookfield (Uncured) 5000 cps ASTM D1084
Total cure time(d, 25℃) 3-7 *****
Elongation(%) ≥150 ASTM D412
Hardness(Shore A) 25 ASTM D2240
Lap Shear Strength(MPa) ≥2.0 ASTM D1876
Peel Strength(N/mm) >3.5 ASTM D1876
Operation temperature(℃) -60~250 *****
Volume Resistivity(Ω·cm) 2.0×1016 ASTM D257
Dielectric Strength(KV/mm) 21 ASTM D149
Dielectric Constant (1.2MHz) 2.9 ASTM D150
Thermal Conductivity W/(m·K) 1.2 ASTM D5470
Flame Retardancy UL94 V-0 E331100

 

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 
FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2006

  • Total Annual:

    100000-160000

  • Employee Number:

    100~150

  • Ecer Certification:

    Verified Supplier

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.     Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.     Ziitek D-U-N-S...

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Get in touch with us

  • Reach Us
  • Dongguan Ziitek Electronic Materials & Technology Ltd.
  • Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
  • https://www.thermalconductivematerials.com/

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