Supply Ability | 1000PC/Day |
Delivery Time | 2-3 work day |
Packaging Details | 300ml/1PC |
packing | 300ml/1PC |
Appearance | White paste |
Tack-free time | ≤20(min,25℃) |
Peel Strength | >3.5(N/mm) |
Viscosity@25℃ Brookfield (Uncured) | 20K cps |
Total cure time | 3-7(d, 25℃) |
Brand Name | Ziitek |
Model Number | TIS580-10 |
Certification | RoHs |
Place of Origin | China |
View Detail Information
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Product Specification
Supply Ability | 1000PC/Day | Delivery Time | 2-3 work day |
Packaging Details | 300ml/1PC | packing | 300ml/1PC |
Appearance | White paste | Tack-free time | ≤20(min,25℃) |
Peel Strength | >3.5(N/mm) | Viscosity@25℃ Brookfield (Uncured) | 20K cps |
Total cure time | 3-7(d, 25℃) | Brand Name | Ziitek |
Model Number | TIS580-10 | Certification | RoHs |
Place of Origin | China | ||
High Light | high temperature adhesive ,thermally conductive adhesives ,300ml/1PC thermal conductive adhesive |
Void Free Surface Thermal Conductive Adhesive 1.0W / mK for Power Modules / IGBT / Computer
TIS™580-10 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-10 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-10 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
Feature
> Good thermal conductivity: 1.0W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Semiconductor cases and heat sinks |
Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices |
CPUs and GPUs |
Automatic dispensing and screen-printing |
Mobile, desktop |
Engine and transmission control modules |
Memory modules |
Power conversion equipment |
Power supplies and UPS |
Power semiconductors |
Custom ASICS Chips |
Integrated Gate Bipolar Transistors (IGBT) |
Between any heat generating semiconductor and heat sink |
Custom power modules |
Telecommunications and automotive electronics |
LED Power Supply |
LED Controller |
LED Lights |
LED Ceilinglamp |
Typical values of TISTM580-10 | ||
Appearance | White paste | Test Method |
Density(g/cm3,25℃) | 1.3 | ASTM D297 |
Tack-free time(min,25℃) | ≤20 | ***** |
Cure type(1-component) | Dealcoholized | ***** |
Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
Total cure time(d, 25℃) | 3-7 | ***** |
Elongation(%) | ≥150 | ASTM D412 |
Hardness(Shore A) | 25 | ASTM D2240 |
Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
Peel Strength(N/mm) | >3.5 | ASTM D1876 |
Operation temperature(℃) | -60~250 | ***** |
Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
Dielectric Strength(KV/mm) | 21 | ASTM D149 |
Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
Thermal Conductivity W/(m·K) | 1.0 | ASTM D5470 |
Flame Retardancy | UL94 V-0 | E331100 |
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S...
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