Supply Ability | 1000SQM/Day |
Delivery Time | 2-3Work day |
Packaging Details | 10RL/bag |
Adhesive Type | Acrylic Adhesive |
Peel Adhesion | 1300 g/inch2 |
Thermal Conductivity | 1.0 W/mK |
ThermalImpedance@50psi | 0.43 ℃-in²/W |
Holding Power 25℃/Days | > 120 kg/inch2 |
Brand Name | Ziitek |
Model Number | TIA800AL |
Certification | RoHs |
Place of Origin | China |
View Detail Information
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Product Specification
Supply Ability | 1000SQM/Day | Delivery Time | 2-3Work day |
Packaging Details | 10RL/bag | Adhesive Type | Acrylic Adhesive |
Peel Adhesion | 1300 g/inch2 | Thermal Conductivity | 1.0 W/mK |
ThermalImpedance@50psi | 0.43 ℃-in²/W | Holding Power 25℃/Days | > 120 kg/inch2 |
Brand Name | Ziitek | Model Number | TIA800AL |
Certification | RoHs | Place of Origin | China |
High Light | thermally conductive adhesive tape ,acrylic adhesive tape ,1.0 W/mK Sensitive Acrylic Adhesive |
Power Converter PCB Thermal Conductive Adhesive , Glass Fiber Backing Pressure Sensitive Acrylic Adhesive
The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Features
> Thermal Conductivity: 1.0 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive
Applications
> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting
Typical Properties of TIA™800FG Series | |||||||
Product Name | TIATM805FG | TIATM806FG | TIATM808FG | TIATM810FG | TIATM815FG | TIATM820FG | Test Method |
Color | White | Visual | |||||
Adhesive Type | Acrylic Adhesive | ******** | |||||
Backing Type | Glass fiber | ******** | |||||
Composite Thickness | 0.005" 0.127mm | 0.006" 0.152mm | 0.020" 0.203mm | 0.010" 0.254mm | 0.015" 0.381mm | 0.020" 0.508mm | ASTM D374 |
Aluminum Foil Thickness | ±0.001" ±0.025mm | ±0.001" ±0.025mm | ±0.0012" ±0.03mm | ±0.0012" ±0.03mm | ±0.0015" ±0.038mm | ±0.002" ±0.05mm | ASTM D374 |
Voltage Breakdown | > 2000 Vac | > 2000 Vac | > 2300 Vac | > 3000 Vac | > 3500 Vac | > 3500 Vac | ASTM D149 |
Peel Adhesion | 1200 g/inch2 | JIS K02378 | |||||
Holding Power 25℃/Days | > 120 kg/inch2 | JIS K023711 | |||||
Holding Power 120℃/Hours | > 10 kg/inch2 | JIS K023711 | |||||
Recommend Using Pressure | 10 psi | ******** | |||||
Thermal Conductivity | 1.0 W/mK | ******** | |||||
Thermal Impedance@50psi | 0.52℃-in²/W | 0.59℃-in²/W | 0.83℃-in²/W | 0.91℃-in²/W | 1.15℃-in²/W | 1.43℃-in²/W | ASTM D5470 |
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S...
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