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China factory - Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd.

  • China,Dongguan ,Guangdong
  • Verified Supplier

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China 1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room
China 1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room

  1. China 1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room
  2. China 1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room

1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room

  1. MOQ: 25PC
  2. Price:
  3. Get Latest Price
Supply Ability 1000PC/Day
Delivery Time 2-3 work days
Packaging Details 300ml/1PC
Products name 1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
Appearance White paste
Density(g/cm3,25℃) 1.2
Operation temperature(℃) -60~250
Thermal Conductivity 1.2 W/(m·K)
Application highpower LED and internal storage module etc
Hardness 25 Shore 00
Brand Name ziitek
Model Number TIS580-12
Certification RoHs
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Supply Ability 1000PC/Day Delivery Time 2-3 work days
Packaging Details 300ml/1PC Products name 1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
Appearance White paste Density(g/cm3,25℃) 1.2
Operation temperature(℃) -60~250 Thermal Conductivity 1.2 W/(m·K)
Application highpower LED and internal storage module etc Hardness 25 Shore 00
Brand Name ziitek Model Number TIS580-12
Certification RoHs Place of Origin China
High Light thermally conductive adhesivesacrylic based adhesive

1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

 

TIS580-12 Series Datasheet-(E)-REV01.pdf

 

Feature

 
Good thermal conductivity: 1.2W/mK
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Longer working life
Excellent thermal shock resistance

 
Application
 
It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-13, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
 
 
Typical values of TISTM580-12
Appearance White paste Test Method
Density(g/cm3,25℃) 1.3 ASTM D297
Tack-free time(min,25℃) ≤20 *****
Cure type(1-component) Dealcoholized *****
Viscosity@25℃ Brookfield (Uncured) 20K cps ASTM D1084
Total cure time(d, 25℃) 3-7 *****
Elongation(%) ≥150 ASTM D412
Hardness(Shore A) 25 ASTM D2240
Lap Shear Strength(MPa) ≥2.0 ASTM D1876
Peel Strength(N/mm) >3.5 ASTM D1876
Operation temperature(℃) -60~250 *****
Volume Resistivity(Ω·cm) 2.0×1016 ASTM D257
Dielectric Strength(KV/mm) 21 ASTM D149
Dielectric Constant (1.2MHz) 2.9 ASTM D150
Thermal Conductivity W/(m·K) 1.2 ASTM D5470
Flame Retardancy UL94 V-0

E331100

 
Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2006

  • Total Annual:

    100000-160000

  • Employee Number:

    100~150

  • Ecer Certification:

    Verified Supplier

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.     Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.     Ziitek D-U-N-S...

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Get in touch with us

  • Reach Us
  • Dongguan Ziitek Electronic Materials & Technology Ltd.
  • Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
  • https://www.thermalconductivematerials.com/

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