Dongguan Ziitek Electronic Materials & Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 days |
| Packaging Details | 1000pcs/bag |
| Products name | High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU |
| Hardness | 60 shore 00 |
| Thickness | 2.0mmT |
| Specific gravity | 2.3g/cc |
| Construction | Ceramic filled silicone elastomer |
| Thermal condutivity | 1.5W/mK |
| Application | Laptop Graphics Card CPU GPU |
| Keywords | Thermal Conductive Silicone Pad |
| Brand Name | ZIITEK |
| Model Number | TIF180-02F |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 100000pcs/day |
| Delivery Time | 3-5 days | Packaging Details | 1000pcs/bag |
| Products name | High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU | Hardness | 60 shore 00 |
| Thickness | 2.0mmT | Specific gravity | 2.3g/cc |
| Construction | Ceramic filled silicone elastomer | Thermal condutivity | 1.5W/mK |
| Application | Laptop Graphics Card CPU GPU | Keywords | Thermal Conductive Silicone Pad |
| Brand Name | ZIITEK | Model Number | TIF180-02F |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | Thermal Conductive Silicone Pad 2.0mmT ，DVD-Rom Cooling Thermal Conductive Silicone Pad ，UL Silicone Thermal Pad | ||
High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
The TIF180-02F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipationfins or the metal base.Their flexibility and elasticity make them suited tocoat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductivity: 1.5 W/mK
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness
Application
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
|
Typical Properties of TIF180-02F Series
|
||||
|
Color
|
Gray |
Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
|
Construction &
Compostion |
Ceramic filled silicone elastomer
|
*** | 10mils / 0.254 mm |
0.48 |
| 20mils / 0.508 mm |
0.56 |
|||
|
Specific Gravity
|
2.3 g/cc |
ASTM D297 |
30mils / 0.762 mm |
0.71 |
|
40mils / 1.016 mm |
0.80 |
|||
|
Heat Capacity
|
1 l/g-K |
ASTM C351 |
50mils / 1.270 mm |
0.91 |
|
60mils / 1.524 mm |
0.94 |
|||
|
Hardness
|
60 Shore 00 | ASTM 2240 |
70mils / 1.778 mm |
1.05 |
|
80mils / 2.032 mm |
1.15 |
|||
|
Tensile Strength
|
40 psi |
ASTM D412 |
90mils / 2.286 mm |
1.25 |
|
100mils / 2.540 mm |
1.34 |
|||
|
Continuos Use Temp
|
-40 to 160℃ |
*** |
110mils / 2.794 mm |
1.43 |
|
120mils / 3.048 mm |
1.52 |
|||
|
Dielectric Breakdown Voltage
|
>5500 VAC | ASTM D149 |
130mils / 3.302mm |
1.63 |
|
140mils / 3.556 mm |
1.71 |
|||
|
Dielectric Constant
|
4.5 MHz | ASTM D150 |
150mils / 3.810 mm |
1.81 |
|
160mils / 4.064 mm |
1.89 | |||
|
Volume Resistivity
|
1.0X10¹² Ohm-meter | ASTM D257 |
170mils / 4.318 mm |
1.98 |
|
180mils / 4.572 mm |
2.07 |
|||
|
Fire rating
|
94 V0 |
equivalent UL |
190mils / 4.826 mm |
2.14 |
|
200mils / 5.080 mm |
2.22 |
|||
|
Thermal conductivity
|
1.5 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Product Thicknesses:
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x4O6mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S...
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