Suntek Electronics Co., Ltd.
Products
Manufacturer of a wide range of products which include High Quality High-speed PCB Gold Finger Board Manufacturer 38L Max Layer Speed,Thick Copper 5OZ pcb fabrication and assembly,Thick Copper 5OZ Printed Circuit Board Assembly Se...
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Tolerance of PTH | +/-0.05mm |
| Brand Name | Suntek |
| Model Number | F56 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| Hole min. | 0.1mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Solder mask | Green,Blue,Black,Red,White,Matt color |
| Brand Name | Suntek |
| Model Number | F016-006 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| Hole min. | 0.1mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Brand Name | Suntek |
| Model Number | F016-006 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Tolerance of PTH | +/-0.05mm |
| Brand Name | Suntek |
| Model Number | F561 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Impedance Contronl | +/-10% |
| Brand Name | Suntek |
| Model Number | F568 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 1pcs
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4 |
| Copper | 35um |
| Impedance control | Yes |
| Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Thickness | 1.6 mm |
| Layer | 4Layers |
| silkscreen color | white,black |
| X-RAY inspection | For BGA,OFN,QFP with bottom pads |
| soldering mask color | Green |
| internal copper | 1.2mil |
| Brand Name | Suntek Electronics Co., Ltd |
| Model Number | 2024-PCBA-074 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China |
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