Products
Manufacturer of a wide range of products which include China Cambodia Suntek Custom FPC Circuit Board HASL Surface Finish Flexible PCBA,Thick Copper 5OZ pcb fabrication and assembly,Thick Copper 5OZ Printed Circuit Board Assembly ...
MOQ: 5pcs
Price: USD+1-100+PCS
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
min package | 0201(0.6mm*0.3mm) |
Brand Name | Suntek |
Model Number | SBBF0326-6 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(Tg130-Tg180) |
Thickness | 0.4mm-5mm |
Layer | 1L-32L |
Size at max. | 1200*400mm |
Hole min. | 0.1mm |
LW/LS min. | 0.05mm |
Copper | 0.5--10OZ |
Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
Solder mask | Green,Blue,Black,Red,White,Matt color |
Brand Name | Suntek |
Model Number | F016-006 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(Tg130-Tg180) |
Thickness | 0.4mm-5mm |
Layer | 1L-32L |
Size at max. | 1200*400mm |
Hole min. | 0.1mm |
LW/LS min. | 0.05mm |
Copper | 0.5--10OZ |
Brand Name | Suntek |
Model Number | F016-006 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: Based on Parts list
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1 week after all components collected |
Packaging Details | cartons and ESD bags |
Material | Kapton,Polyimide(PI), Polyester(PET), FR4 |
Color | Red,Green,Black,Purple,White |
Big Size | 1200*400mm |
Layer | 1 to 6 Layers |
Base Copper Thickness | 1/3 oz to 8oz |
Regular Base Material Thickness | 12.5um to 50um(FPC) 0.1mm to 3.2mm(Rigid) |
Regular Adhesive Thickness | 12um to 25um |
Blind or Buried Vias | Yes |
Impedance Control | Yes |
Min.Line Width/Spacing | 0.04mm/0.04mm |
Surface Finishing | HASL OSP ENIG |
Outline Fabrication | Die cut, laser cut, CNC routing, V-scoring |
Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
Brand Name | Suntek |
Model Number | SFBF1 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD+1-100+PCS
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
min package | 0201(0.6mm*0.3mm) |
Brand Name | Suntek |
Model Number | SBBF03 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD1-100/pcs
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
min package | 0201(0.6mm*0.3mm) |
Brand Name | Suntek |
Model Number | SBBF0326-6 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD+1-100+PCS
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
min package | 0201(0.6mm*0.3mm) |
Brand Name | Suntek |
Model Number | SBBF0326-6 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 1pcs
Price: Customized products
Payment Terms | TT,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | PI |
Thickness | 0.4mm-3mm |
Layer | 4Layers |
silkscreen color | white |
LW/LS min. | 0.05mm |
Copper | 0.5--5OZ |
Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
PCB process | immersion gold |
X-RAY inspection | For BGA,OFN,QFP with bottom pads |
Impedance control | Yes |
Brand Name | Suntek Electronics Co., Ltd |
Model Number | 2024-PCBA-011 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1pcs
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
silkscreen color | white |
Layer | 2Layers |
Material | PI |
Thickness | 0.4mm-3mm |
LW/LS min. | 0.05mm |
Copper | 0.5--5OZ |
Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
PCB process | immersion Tin |
X-RAY inspection | For BGA,OFN,QFP with bottom pads |
Impedance control | Yes |
Brand Name | Suntek Electronics Co., Ltd |
Model Number | 2024-PCBA-022 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1pcs
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | PI |
Thickness | 0.4mm-3mm |
Layer | 4Layers |
silkscreen color | white |
LW/LS min. | 0.05mm |
Copper | 0.5--5OZ |
Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
PCB process | immersion gold |
X-RAY inspection | For BGA,OFN,QFP with bottom pads |
Impedance control | Yes |
Brand Name | Suntek Electronics Co., Ltd |
Model Number | 2024-PCBA-022 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
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