Products
Manufacturer of a wide range of products which include FPC Assembly 1-12 Layers ENIG Surface Insulating Film 0.05mm Copper 35um FPC,Thick Copper 5OZ pcb fabrication and assembly,Thick Copper 5OZ Printed Circuit Board Assembly Serv...
MOQ: 5pcs
Price: Based on Parts list
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1 week after all components collected |
Packaging Details | cartons and ESD bags |
Material | Kapton,Polyimide(PI), Polyester(PET), FR4 |
Color | Red,Green,Black,Purple,White |
Big Size | 1200*400mm |
Layer | 1 to 6 Layers |
Base Copper Thickness | 1/3 oz to 8oz |
Regular Base Material Thickness | 12.5um to 50um(FPC) 0.1mm to 3.2mm(Rigid) |
Regular Adhesive Thickness | 12um to 25um |
Blind or Buried Vias | Yes |
Impedance Control | Yes |
Min.Line Width/Spacing | 0.04mm/0.04mm |
Surface Finishing | HASL OSP ENIG |
Outline Fabrication | Die cut, laser cut, CNC routing, V-scoring |
Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
Brand Name | Suntek |
Model Number | SFBF1 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(Tg130-Tg180) |
Thickness | 0.4mm-5mm |
Layer | 1L-32L |
Size at max. | 1200*400mm |
Hole min. | 0.1mm |
LW/LS min. | 0.05mm |
Copper | 0.5--10OZ |
Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
Solder mask | Green,Blue,Black,Red,White,Matt color |
Brand Name | Suntek |
Model Number | F016-006 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(Tg130-Tg180) |
Thickness | 0.4mm-5mm |
Layer | 1L-32L |
Size at max. | 1200*400mm |
Hole min. | 0.1mm |
LW/LS min. | 0.05mm |
Copper | 0.5--10OZ |
Brand Name | Suntek |
Model Number | F016-006 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: USD+1-100+PCS
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
min package | 0201(0.6mm*0.3mm) |
Brand Name | Suntek |
Model Number | SBBF0326-6 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD+1-100+PCS
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
min package | 0201(0.6mm*0.3mm) |
Brand Name | Suntek |
Model Number | SBBF03 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD1-100/pcs
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
min package | 0201(0.6mm*0.3mm) |
Brand Name | Suntek |
Model Number | SBBF0326-6 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD+1-100+PCS
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
min package | 0201(0.6mm*0.3mm) |
Brand Name | Suntek |
Model Number | SBBF0326-6 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 1pcs
Price: Customized products
Payment Terms | TT,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | PI |
Thickness | 0.4mm-3mm |
Layer | 4Layers |
silkscreen color | white |
LW/LS min. | 0.05mm |
Copper | 0.5--5OZ |
Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
PCB process | immersion gold |
X-RAY inspection | For BGA,OFN,QFP with bottom pads |
Impedance control | Yes |
Brand Name | Suntek Electronics Co., Ltd |
Model Number | 2024-PCBA-011 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1pcs
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
silkscreen color | white |
Layer | 2Layers |
Material | PI |
Thickness | 0.4mm-3mm |
LW/LS min. | 0.05mm |
Copper | 0.5--5OZ |
Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
PCB process | immersion Tin |
X-RAY inspection | For BGA,OFN,QFP with bottom pads |
Impedance control | Yes |
Brand Name | Suntek Electronics Co., Ltd |
Model Number | 2024-PCBA-022 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1pcs
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | PI |
Thickness | 0.4mm-3mm |
Layer | 4Layers |
silkscreen color | white |
LW/LS min. | 0.05mm |
Copper | 0.5--5OZ |
Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
PCB process | immersion gold |
X-RAY inspection | For BGA,OFN,QFP with bottom pads |
Impedance control | Yes |
Brand Name | Suntek Electronics Co., Ltd |
Model Number | 2024-PCBA-022 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
Explore more categories
Get in touch with us
Leave a Message, we will call you back quickly!