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China factory - Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven
China Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

  1. China Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

  1. MOQ: ≥1 pc
  2. Price: Negotiable
  3. Get Latest Price
Payment Terms T/T
Delivery Time 25~50 days
Packaging Details Plywood crate
Name Reflow Soldering Oven
Model SEMI-08N
Dimension 5680(L)*1710(W)*1650(H)mm
Weight 2400-2600kg
Power AC3Ø 5W 380V 50/60HZ
Total Power 70KW
Normal consumption 10KW
Control type PC+PLC Control system
Temp Control accuracy ±1℃
PCB Temp Deviation ±1.5℃
Power Outage Protection Equipped with UPS
N2 area Full nitrogen filling
Brand Name Suneast
Model Number SEMI-08N|SEMI-10N|SEMI-13N
Certification CE、ISO
Place of Origin Shenzhen, Guangdong Province, China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Delivery Time 25~50 days
Packaging Details Plywood crate Name Reflow Soldering Oven
Model SEMI-08N Dimension 5680(L)*1710(W)*1650(H)mm
Weight 2400-2600kg Power AC3Ø 5W 380V 50/60HZ
Total Power 70KW Normal consumption 10KW
Control type PC+PLC Control system Temp Control accuracy ±1℃
PCB Temp Deviation ±1.5℃ Power Outage Protection Equipped with UPS
N2 area Full nitrogen filling Brand Name Suneast
Model Number SEMI-08N|SEMI-10N|SEMI-13N Certification CE、ISO
Place of Origin Shenzhen, Guangdong Province, China
High Light combined multi module selective wave solderingswave soldering combined multi module selectivemulti module selective wave soldering combined

SEMI Series Modular Design Semiconductor Reflow Soldering Oven Hot Air System

 

Application:

  • The solder paste which is printed on the convex metal surface will be refluxed into a ball to complete the combination welding of the tin ball and the substrate
  • After the chip is placed to the PCB, the chip and the circuit board are connected together to realize the chip packaging and integrated circuit manufacturing

 

Core Technology:

01 Hot air system with patent, efficient heat compensation ability, accurate temperature control accuracy

02 With nitrogen protection in the whole process, independent nitrogen control in each temperature zone, to prevent components oxidation during the welding process

03 Low oxygen content control in the furnace which will be within 50-200PPM during the whole process, to ensure good welding quality

04 Modular design, efficient cooling system, cooling slope can reach 0.5-6℃/S, to meet the requirements of each process cooling slope

05 Fine mesh belt for smooth conveying, also for tiny components transmission, prevent falling, to ensure stable product quality

06 Efficient and clean treatment, to meet the requirements of dust-free workshop for semiconductor

 

Product Features:

CONVEYOR SYSTEM

Special fine mesh belt transmission for semiconductor, for tiny components, to prevent falling and jamming

HOT AIR SYSTEM MULTI-FREQUENCY CONTROL

Multi-frequency converter control, more precise temperature control, the air flow range can be controlled from low to high, to ensure that the control system is stable and reliable

ROSIN RECOVERY SYSTEM

There’re independent rosin recovery devices at the inlet and outlet sides, and also for the preheating area, multistage filtration

FULL NITROGEN PROTECTION SYSTEM,

LOW OXYGEN CONTENT

The nitrogen is charging in the whole process and controlled Independently in each process section; ultra-low oxygen concentration environment, and the oxygen content in the furnace can be within 50PPM to ensure excellent welding quality

LOW NITROGEN CONSUMPTION

Brand new furnace structure design, multi-layer heat insulation, closed-loop control of recovery system, effectively save the amount of nitrogen and save the use cost

EFFICIENT HOT AIR CIRCULATION HEATING SYSTEM

Multi-layer heat insulation design, high stability of thermal

efficiency, low energy consumption, reduce production costs

COOLING SYSTEM

Cooling zone with high power cold water system to ensure optimal cooling slope

CONTROL SYSTEM

Super temperature control ability, to meet the packaging heating process profile of semiconductor

HIGH CLEANLINESS

Special clean room for R&D, thousand level of cleanliness, to meet the requirements of high cleanliness environment of semiconductor equipment

CONVEYOR SYSTEM

The software supports SECS/GEM semiconductor communication protocol, connects the intelligent factory information and control system, which can effectively realizes the functions of connection management, data collection, alarm, control status, equipment terminal service and message log, etc

 

Product Parameters:

Model No SEMI-08N SEMI-10N SEMI-13N
Heating system
Heating zone structure

8 heating zones,

16 heating modules

10 heating zones,

20 heating modules

13 heating zones,

26 heating modules

Heating zone length 2950mm 3670mm 4750mm
Heating up time 20min 25min 25min
Outlet Exhaust Diameter,valume 2-Ø145,Exhaust demand 10m³/min x2
Cooling system
Cooling type Three cooling zones:forced water cooling
Cooling zone length 1250mm
Chiller power External Water chiller (Optional: connected to customer workshop cooling water)
Conveyor system
Conveyor Type Fine mesh mesh belt (Optional: B-shaped mesh belt, force bone mesh belt)
Conveyor Direction L→R,R→L
Conveyor Height 900±20mm
Mesh belt width 24" (Other width sizes can be customized.)
Component Height 20mm
Conveyor Speed 300mm-2000mm/min
Control system
Power AC3Ø 5W 380V 50/60HZ
Total Power 70KW 89KW 118KW
Startup Power 35KW 38KW 42KW
Normal consumption 10KW 12KW 14KW
Temp Control Range Room temperature to 320℃
Control type PC+PLC Control system
Temp Control accuracy ±1℃
PCB Temp Deviation ±1.5℃
Data Storage Process Data and status stotage
Power Outage Protection Equipped with UPS
Operation Interface Windows Chinese simplified, English online free switching
N2 area Full nitrogen filling
Secs/Gemcommunication protocol Standard
MES communication protocol Standard
Computer Commercial computer
Machine Parameter
Dimension(LxWxH) 5680x1710x1650mm 6400*1710*1650mm 7500*1710*1650mm
Weight 2400-2600kg 3200-3400kg 3600-3800kg
Flux recovery system Standard
Color Bright wrinkled white

 

Notices:

1.Power requirements:

①Three phase five wire: voltage 380V, frequency 50/60HZ;

②Wire diameter above 25mm², leakage protection switch 160A, leakage protection switch leakage capacity 150-200mA.

2.The ground is required to withstand a pressure of 1000kg/m²

3.External ventilation requirements: air duct Ø145mm, ventilation volume 15-20M³/min.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    1984

  • Total Annual:

    30000000-45000000

  • Employee Number:

    300~500

  • Ecer Certification:

    Verified Supplier

   Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering...    Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering...

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Get in touch with us

  • Reach Us
  • Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
  • Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
  • https://www.suneast1984.com/

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