Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
| Payment Terms | T/T |
| Delivery Time | 25~50 days |
| Packaging Details | Plywood crate |
| Name | IC Bonder |
| Model | WBD2200 PLUS |
| Machine dimension | 2480(L)*1470(W)*1700(H)mm |
| Placement accuracy | ≤±15um@3σ |
| Placement angle accuracy | ±0.3 °@3σ |
| Die size | 0.25*0.25mm-10*10mm |
| Core module movement mode | Linear motor + grating scale |
| Glue feeding mode | Dispensing + painting glue |
| Loading / Unloading | Manual / auto |
| Customizable | Yes |
| Brand Name | Suneast |
| Model Number | WBD2200 PLUS |
| Certification | CE、ISO |
| Place of Origin | Shenzhen, Guangdong Province, China |
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Product Specification
| Payment Terms | T/T | Delivery Time | 25~50 days |
| Packaging Details | Plywood crate | Name | IC Bonder |
| Model | WBD2200 PLUS | Machine dimension | 2480(L)*1470(W)*1700(H)mm |
| Placement accuracy | ≤±15um@3σ | Placement angle accuracy | ±0.3 °@3σ |
| Die size | 0.25*0.25mm-10*10mm | Core module movement mode | Linear motor + grating scale |
| Glue feeding mode | Dispensing + painting glue | Loading / Unloading | Manual / auto |
| Customizable | Yes | Brand Name | Suneast |
| Model Number | WBD2200 PLUS | Certification | CE、ISO |
| Place of Origin | Shenzhen, Guangdong Province, China | ||
| High Light | combined wave soldering multi module selective ，magnetic spring motor ce iso ，iso ce magnetic spring motor | ||
Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers
General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes.
Features:
Main application:
It is suitable for mass wafer loading products, and for SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. It is mainly used in automotive electronics, medical electronics, optoelectronics, mobile phones and other industries.
Product advantage:
| High precision Accuracy :±15μm@3σ Angle: Die size: > 1 x 1 mm ±0.3°@3σ Die size: < 1 x 1 mm ±1°@3σ | |
| Material box loading Fully automatic feeding and discharging Warehouse processing system, supported by SMEMA online communication agreement,support the SECS/GEM protocol | |
| Stacking loading Multiple feeding methods, compatible with stacking feeding function, improving customer selectivity | |
| Nozzle station Equipped with a fully automatic wafer loading and unloading processing system, support to the SECS/GEM protocol | |
| Visual recognition 2448x2048 resolution 256 gray levels Support gray value template, custom shape template The platform can be positioned twice The angle error is ±0.01deg | |
| Real-time compensation It can detect the image after bonding and do automatic real-time compensation to ensure stable mounting accuracy | |
Product Parameters:
| Item | Specification |
| Placement accuracy | ±15um@3σ |
| Placement angle accuracy | ±0.3°@3σ |
| Force control range | 20~1000g(with different configurations, the maximum support is 7500g) |
| Force control accuracy | 20g-150g:± 2g@3σ 150g-1000g:±5%@3σ |
| Silicon wafer processing(mm) | Maximum 12“(300mm) Compatible 8”(150mm) |
| Die size(mm) | 0.25*0.25mm-10*10mm |
| Loading / Unloading | Manual / auto |
| Applicable material box(mm) | L 110-310; W 20-110; H 70-153 |
| Applicable lead frame(mm) | L 100-300; W38-100; H 0.1-0.8 |
| Core module movement mode | Linear motor + grating scale |
| Glue feeding mode | Dispensing + painting glue |
| Bottom photo-taking | Option |
| Machine dimension(mm) | L(2480)*W(1470)*H(1700) |
| Weight | Net weight of equipment:Approx.1800Kg |
Notices:
1.Leakage protection switch: ≥100ma
2.Compressed air requirement: 0.4-0.6Mpa
Inlet pipe specification: Ø10mm
3.Vacuum requirement:<-88kPa
Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces
4.Power requirements:
①Voltage: AC220V, frequency 50/60HZ;
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.
5.The ground is required to withstand a pressure of 800kg/m²
Company Details
Business Type:
Manufacturer
Year Established:
1984
Total Annual:
30000000-45000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering... Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering...
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