Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
| Payment Terms | T/T |
| Delivery Time | 25~50 days |
| Packaging Details | Plywood crate |
| Name | IC Bonder |
| Model | CBD2200 |
| Machine dimension | 1610(L)*1380(W)*1620(H)mm |
| Placement accuracy | ±10um@3σ |
| Placement angle accuracy | ±0.3°@3σ |
| Die size | 0.25*0.25mm-10*10mm |
| Substrate size | L300*W100 |
| Placement pressure | 30-500g |
| Glue feeding mode | Dispensing, dipping, painting |
| Customizable | Yes |
| Brand Name | Suneast |
| Model Number | CBD2200 |
| Certification | CE、ISO |
| Place of Origin | Shenzhen, Guangdong Province, China |
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Product Specification
| Payment Terms | T/T | Delivery Time | 25~50 days |
| Packaging Details | Plywood crate | Name | IC Bonder |
| Model | CBD2200 | Machine dimension | 1610(L)*1380(W)*1620(H)mm |
| Placement accuracy | ±10um@3σ | Placement angle accuracy | ±0.3°@3σ |
| Die size | 0.25*0.25mm-10*10mm | Substrate size | L300*W100 |
| Placement pressure | 30-500g | Glue feeding mode | Dispensing, dipping, painting |
| Customizable | Yes | Brand Name | Suneast |
| Model Number | CBD2200 | Certification | CE、ISO |
| Place of Origin | Shenzhen, Guangdong Province, China | ||
| High Light | wave soldering selective combined multi module ，multi module combined wave soldering selective ，multi module wave soldering selective combined | ||
Supermini Chip Placement Quick Changeover IC Bonder CBD2200
Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips.
Features:
Main application:
It is suitable for a variety of small batch of placing products, automatically switch to a variety of mounting head, quickly achieve to place a variety of chip with different. It is mainly used in the military products RF and power module power amplifier.
Product Parameters:
| Item | Specification |
| Placement accuracy | ±10um@3σ |
| Placement angle accuracy | ±0.3°@3σ |
| Loading mode | Wafer box |
| Die size(mm) | 0.25*0.25mm-10*10mm |
| PCB size(mm) | L300*W100 |
| Placement head | 0-360°rotation/Auto change nozzle(option) |
| Placement pressure(N) | 30-500g |
| Glue feeding mode | Support: dispensing, dipping, painting |
| Core motion module | Linear motor + grating scale |
| Platform base of machine | Marble platform |
| Machine dimension(L×W×H) | 1610mm×1380mm×1620mm |
Notices:
1.Leakage protection switch: ≥100ma
2.Compressed air requirement: 0.4-0.6Mpa
Inlet pipe specification: Ø10mm
3.Vacuum requirement:<-88kPa
Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces
4.Power requirements:
①Voltage: AC220V, frequency 50/60HZ
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.
5.The ground is required to withstand a pressure of 800kg/m².
Company Details
Business Type:
Manufacturer
Year Established:
1984
Total Annual:
30000000-45000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering... Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering...
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