Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
| Payment Terms | T/T |
| Delivery Time | 25~50 days |
| Packaging Details | Plywood crate |
| Name | Screen Printing Machine |
| Model | T3 Plus |
| Machine Dimension | 1140(L)*1380(W)*1530(H)mm |
| Weight | Approx.900Kg |
| Total Power | Approx.3kw |
| Main Power Supply | AC 220V±10% 50/60HZ Single phase |
| Main Air Supply | 4.5～6kgf/cm2 |
| Min PCB | 50(X)×50(Y) (mm) |
| Max PCB | 400(X)×310(Y) (mm) |
| Support | Magnetic support, Magnetic piece, Vacuum chamber（Option） |
| Scraper Pressure | 0~20kg |
| Customizable | Yes |
| Brand Name | Suneast |
| Model Number | T3 Plus/T3 BTB/T3 Plus BTB |
| Certification | CE、ISO |
| Place of Origin | Shenzhen, Guangdong Province, China |
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Product Specification
| Payment Terms | T/T | Delivery Time | 25~50 days |
| Packaging Details | Plywood crate | Name | Screen Printing Machine |
| Model | T3 Plus | Machine Dimension | 1140(L)*1380(W)*1530(H)mm |
| Weight | Approx.900Kg | Total Power | Approx.3kw |
| Main Power Supply | AC 220V±10% 50/60HZ Single phase | Main Air Supply | 4.5～6kgf/cm2 |
| Min PCB | 50(X)×50(Y) (mm) | Max PCB | 400(X)×310(Y) (mm) |
| Support | Magnetic support, Magnetic piece, Vacuum chamber（Option） | Scraper Pressure | 0~20kg |
| Customizable | Yes | Brand Name | Suneast |
| Model Number | T3 Plus/T3 BTB/T3 Plus BTB | Certification | CE、ISO |
| Place of Origin | Shenzhen, Guangdong Province, China | ||
| High Light | wave solder multi module combined selective ，multi module selective solder combined wave ，combined selective solder multi module wave | ||
Intelligent Detection T3 PLUS Full Automatic Screen Printer Mark Point Recognition Technology
Solder paste printing machines are mainly used to print solder paste on the surface of circuit boards (PCBs). Apply solder paste evenly onto the solder pads of the circuit board using tools such as scrapers, providing precise and uniform solder paste distribution for subsequent electronic component soldering. The solder paste printing machine can accurately control the coating position and thickness of solder paste through a high-precision motion control system, ensuring the soldering quality between electronic components and PCBs. Solder paste printing machines are widely used in SMT surface mount production lines in the electronic manufacturing industry.
Features:
Overall diagram:
1 Rack module
2 Lifting module
3 Platform alignment module
4 Housing module
5 Image capture module
6 Stencil frame positioning module
7 Squeegee module
8 Display module
9 Cleaning module
10 Conveyor module
11 Air and power input
Product Parameters:
| Basic Parameters | Screen Frame Size | 520(X)×420(Y)—737(X)×737(Y) (mm) |
| Thickness:20-40mm | ||
| Min PCB(mm) | 50(X)×50(Y) (mm) | |
| Max PCB(mm) | 400(X)×310(Y) (mm) | |
| Thickness | 0.2mm～6mm(Use jig when pcb less than 0.4mm) | |
| Curve | <1%(Diagonal measurement) | |
| PCB Backside Part Height | 10mm | |
| Conveyor Height | 900±40mm | |
| Support | Magnetic support, Magnetic piece, Vacuum chamber(Option) | |
| Clamp | Side clamp(Standard),please read the to option table | |
| Edge Distance | PCB process edge ≥2.5mm | |
| Conveyor Speed | 0~1500mm/sec, increment 1mm | |
| Conveyor Belt | U type sync belt | |
| Stopper method | Air Cylinder | |
| Stopper position | Set the PCB stopper position according to the size of board | |
| Flow direction | L-R,R-L,L-L,R-R depends on customer | |
| Print System | Print Speed | 5-200mm/s adjustable |
| Print Head | Step motor drive scraper lifting | |
| Scraper | Steel scraper,rubber scraper(option) | |
| Scraper Angle | 60° | |
| Scraper Pressure | 0~20kg | |
| Vision System | Substrate Separation | Three-section Substrate Separation speed:0.1-20mm/s distance:0-20mm |
| Alignment Position method | Mark automatic alignment | |
| Camera | Germany BASLER,1/3”CCD,640*480pixel,pixel size:5.6umx5.6um | |
| Acquire image method | Up/under double photo | |
| Camera Light | Coaxial light, Ring light four kinds light can adjustable | |
| View Range | 9mm*7mm | |
| Mark dimensions | Diameter or Side length 1mm～2mm,allowable offset 10% | |
| Mark Shape | Cir,Rec, or rhombus etc | |
| Mark Position | PCB dedicated mark or PCB pad | |
| 2D detection | Standard | |
| Accuracy | Table Adjustment Range | X=±3mm,Y=±7mm, θ=±1.5 |
| Positional Accuracy | ±0.01mm | |
| Printing Accuracy | ±0.025mm | |
| Time | Cycle Time | <10s (ex print, cleaning time) |
| Convert line Time | <5min | |
| Programming Time | <10min | |
| Control System | Computer Configuration | Industrial PC,Windows official system |
| System Language | Chinese,English | |
| Pre and next machine Connection | SMEMA | |
| User authorization | User PW and Senior PW set | |
| Cleaning System | Cleaning System | Dry and Wet(standard),vacuum model(option) |
| Liquid Level Detection | Liquid level auto alarm detection | |
| Power Parameters | Main Power Supply | AC 220V±10% 50/60HZ Single phase |
| Total Power | Approx.3kw | |
| Main Air Supply | 4.5～6kgf/cm2 | |
| Machine Weight | Approx.900Kg | |
| Machine Dimension | 1140(L)x1380(W)x1530(H)mm (standard) /1675(L)mm(add loading unit)/1675(L)mm(add buffering unit /2210(L)mm (add loading and buffering unit) | |
| Option | Pneumatic Top Clamp | For PCB(thickness≤1mm) |
| Top clamp + side clamp | For PCB(thickness≤1mm) | |
| Vacuum Adsorption and unloading | For PCB(thickness≤1mm) and FPC | |
| Auto tin added | Auto tin added | |
| Auto Loading and Unloading | / | |
| Flexible and Universal Support | For the double-sided PCB(PCB backside parts Height ≤ 9mm) | |
| Automatic Positioning of screen frame | Automatic Positioning of screen frame | |
| PCB Thickness Auto Adjustment Function | PCB Thickness Auto Adjustment Function | |
| Squeegee Pressure Feedback Function | Squeegee Pressure Realtime Feedback Function | |
| Air conditioner | Customer can buy by themselves | |
| The rest of Solder Paste on the stencil Monitoring System | The rest of Solder Paste on the stencil Monitoring System | |
| SPI close loop | SPI close loop | |
| UPS power off protection | UPS 15min power off protection | |
| Industry 4.0 | Bar code trace function, production analysis etc |
Notices:
1.Gas source requirements: 4.5-6kgf/cm²; Inlet pipe Ø≥8mm.
2.Power requirements: single-phase AC 220V±10% 50/60HZ, power cord with 4-6mm², equipped with a 16A well grounded socket.
3.Ground pressure requirement: 1000kg/m².
4.During the installation period, arrange 2-3 people to learn and conduct training assessments.
Company Details
Business Type:
Manufacturer
Year Established:
1984
Total Annual:
30000000-45000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering... Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering...
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