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China factory - Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder
China High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder

  1. China High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder
  2. China High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder

  1. MOQ: ≥1 pc
  2. Price: Negotiable
  3. Get Latest Price
Payment Terms T/T,
Delivery Time 25~50 days
Packaging Details Plywood crate
Name IC Bonder
Model CBD2200 EVO
Machine dimension 1400(L)*1250(W)*1700(H)mm
Weight Approx.1500Kg
Placement accuracy ≤±10um@3σ
Placement angle accuracy ±0.15°@3σ
Substrate pallet size L200 X W90~150mm
Core module movement mode Linear motor + grating scale
Glue feeding mode Dispensing + painting glue
Customizable Yes
Brand Name Suneast
Model Number CBD2200 EVO
Certification CE、ISO
Place of Origin Shenzhen, Guangdong Province, China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Delivery Time 25~50 days
Packaging Details Plywood crate Name IC Bonder
Model CBD2200 EVO Machine dimension 1400(L)*1250(W)*1700(H)mm
Weight Approx.1500Kg Placement accuracy ≤±10um@3σ
Placement angle accuracy ±0.15°@3σ Substrate pallet size L200 X W90~150mm
Core module movement mode Linear motor + grating scale Glue feeding mode Dispensing + painting glue
Customizable Yes Brand Name Suneast
Model Number CBD2200 EVO Certification CE、ISO
Place of Origin Shenzhen, Guangdong Province, China
High Light spring motor ce iso magneticmotor iso magnetic spring ceselective wave solder multi module combined

Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design

 

Features:

  • High speed, accurate solidification capacity ±10um@3σ;
  • High production efficiency, low cost input
  • High multi-chip processing capacity, support 16 different types of chip placement
  • High flexibility to support multiple carrier operations
  • Can work in different plane heights, support deep cavity work
  • Modular platform design, small appearance, small footprint

 

Product advantage:

High precision

Accuracy: ±10μm@3σ

Angle: ±0.15°@3σ

High precision linear motor

Waffle pack / Gel-Pak

Supports 16 Waffle packs (2 "x 2")

4”x 4”size is available.

Automatic height measurement

Accuracy: 3μm

Supports a variety of probes

Can be replaced with laser

altimeter according to demand

Nozzle station

Quick automatic nozzle change

Supports 7 nozzle stations.

Visual recognition

2448x2048 resolution

256 gray level

Support gray value template,

custom shape template

The platform can be positioned twice.

The Angle error is ±0.01deg.

Deep cavity operation

Work at different plat heights.

The maximum depth is 11mm.

 

 

Features of dispensing function:

  • Supports various types of epoxy adhesives
  • Meet various graphic dispensing needs
  • Comes with commonly used standard graphics library
  • Support custom graphics library

 

Product parameters:

Item Specification
Placement accuracy ≤±10um@3σ
Placement angle accuracy ±0.15°@3σ
Force control range 20~1000g(with different configurations, the maximum support is 7500g)
Force control accuracy 20g-150g:± 2g@3σ 150g-1000g:±5%@3σ
Substrate pallet size(mm) L200 X W90~150
Tray size(mm) Based on customer products
Loading/Unloading Manual / auto
IC dimension(mm) L0.25X W0.25—L10 X W10
IC supply Waffle tray
Core module movement mode Linear motor + grating scale
Glue feeding mode Dispensing + painting glue
Auto change nozzle Seven
Bottom photo-taking Equipped with camera
Machine dimension(mm) L(1400)*W(1250)*H(1700)
Weight Net weight of equipment:Approx.1500Kg

 

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA

5.The ground is required to withstand a pressure of 800kg/m².

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    1984

  • Total Annual:

    30000000-45000000

  • Employee Number:

    300~500

  • Ecer Certification:

    Verified Supplier

   Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering...    Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering...

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Get in touch with us

  • Reach Us
  • Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
  • Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
  • https://www.suneast1984.com/

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