Semiconductor Oven SEO Series

Product Specification

High Capacity PID Adjustment Semiconductor Oven SEO Series Air Tightness

    The semiconductor oven with nitrogen filled has strong universality, high stability and high performance. It adopts high capacity horizontal air recycling system, adopts special chamber structure and sealing technology, with excellent air tightness and temperature uniformity to meet the high performance requirements of semiconductor products. This oven is suitable for curing semiconductor wafers, IC packages (copper substrate, silver gel, silica gel, epoxy resin), glass substrate and other products.
 
Core Technology:
01 High capacity horizontal air recirculation hot air system to achieve high performance temperature uniformity
02 The chamber is fully sealed design, adopts stainless steel plate, with good air tightness, saving nitrogen
03 High power high temperature resistant long axis motor, and large size turbine blade, which can work stably in high temperature environment for a long time
04 The heating rate is controllable, one-key operation for the process profile setting, with cooling system for cooling, which can effectively improve production efficiency
05 High precision temperature controller, PID adjustment, the control accuracy can reach 0.5℃, reliable control, safe use
06 Efficient clean treatment, thousand-grade cleanroom aging test, to meet the requirements of semiconductor dust-free workshops and products
07 Low oxygen content control, real-time monitoring, dual channel analysis system the oxygen content can be controlled within 50PPM
 
Product features:
SEMICONDUCTOR OVEN CHAMBER STRUCTURE
    The upper and lower boxes are equipped with hot air circulation system, the air speed and volume can be adjusted, and different process parameters can be operated independently. The furnace chamber is made of high quality stainless steel. The furnace is equipped with layered brackets to improve space utilization.

SEMICONDUCTOR OVEN NITROGEN SYSTEM
    Nitrogen filling inside the chamber, equipped with multiple flow meter, with independent adjustment function, to ensure the reasonable use of nitrogen, balanced distribution. With multi-channel oxygen analyzer, real-time monitoring of the oxygen content value in the upper and lower chambers, can be controlled separately, the oxygen content of a single chamber can be controlled within 500PPM (option: within 100PPM).
 

SEMICONDUCTOR OVEN COOLING SYSTEM
    Water cooling system is adopted. Fin radiator blast water cooling, when the temperature in the furnace is cooling, the blower will exchange heat through the fin radiator quickly, it greatly shortens the cooling time. Unique cooling system, avoid instant cooling steam expansion at high temperature, which effectively protect product quality.

SEMICONDUCTOR OVEN SAFETY PROTECTION SYSTEM
    With over-temperature protection (to prevent the studio temperature is too high and protect the product), when the over-temperature situation occurs, it will immediately cut off the power, at the same time, there is an alarm to remind the staff, better protection for products; control and protection of excessive oxygen content; nitrogen low pressure alarm protection; upper and lower boxes are equipped with electronic safety locks, and the equipment has emergency stop switch.

SEMICONDUCTOR OVEN CLARITY TEST
    After testing, the concentration of 0.5μm particle is ≤35200, which meets the production requirements of high-cleanliness thousand-class clean dust-free workshop.

SEMICONDUCTOR OVEN TEMPERATURE PROFILE TEST
    High precision temperature controller, PID regulation, high capacity horizontal air recirculation hot air system, which can achieve high performance temperature uniformity.

 
Product Parameters:

 
Notices:
1.Gas source requirements: Nitrogen working pressure (pressure during use)>0.5-0.8Mpa, nitrogen purity 99.999%.
2.Power requirements:
①Three phase five wire: voltage 380V, frequency 50/60HZ;
②Wire diameter above 25mm², leakage protection switch 100A, leakage protection switch leakage capacity 150-200mA.
3.Ground pressure requirement: 1000kg/m².
4.External ventilation requirements: 2-Ø38mm outer diameter air duct, ventilation volume of 2*5M³/min;
5.Environmental requirements: The ambient temperature range should be between 5-40℃, and the relative humidity range should be between 20-95%.