Smd Rework Station Welding Equipment BGA Rework Station

Product Specification

electronic products machinery pcb line machine smd bga rework station Machine

BGA rework station is a specialized equipment used in the electronic manufacturing industry for reworking Ball Grid Array (BGA) components. It enables the removal and replacement of BGA components on printed circuit boards (PCBs), allowing for repairs and modifications to be made.

The BGA rework station consists of several key components, including a heater, a temperature control system, a microscope, and a vacuum system. The heater is used to heat the BGA component and the PCB, allowing the solder to melt and the component to be easily removed. The temperature control system ensures that the temperature is controlled accurately and precisely, minimizing the risk of damaging the components or the PCB due to excessive heat. The microscope is used to inspect and align the BGA component during the rework process. The vacuum system is used to hold the BGA component in place during the reflow process and ensure a proper connection between the component and the PCB.

The basic principle behind the BGA rework station is the reflow soldering process. BGA components are attached to the PCB using solder balls underneath the component. During rework, the BGA rework station heats up the component and the PCB to a specific temperature that melts the solder, allowing the component to be easily removed. After the removal of the component, the solder pads on the PCB are cleaned and prepared for the replacement component.

BGA Rework station The replacement component is aligned with the solder pads on the PCB using the microscope, ensuring accurate positioning. Once aligned, the component is placed on the PCB and heated again. The solder reflows, creating a strong and reliable connection between the component and the PCB. The vacuum system helps to hold the component in place during the reflow process, ensuring proper alignment and preventing any movement of the component.

During the entire process, it is crucial to maintain an accurate and controlled temperature to prevent damage to the components or the PCB. Excessive heat can cause thermal stress, leading to component or PCB failure. The BGA rework station's temperature control system ensures that the temperature is carefully regulated throughout the rework process, minimizing the risk of damage.

In conclusion, BGA rework station is a specialized equipment used for the removal and replacement of BGA components on PCBs. It utilizes the reflow soldering process and incorporates various components like a heater, a temperature control system, a microscope, and a vacuum system. The station allows for efficient and accurate rework of BGA components, enabling repairs, upgrades, or modifications in the electronic manufacturing industry.

BGA Rework Station
Model:WDS-620
1. Automatic&Manual operation system
2. 5 million CCD camera optical alignment system mount precision:±0.01mm
3. MCGS touch screen control
5. Laser position
6. Repair success rate 99.99%

Temperature Control System

1. 8 segment temperature can be set at same time,It can save thousands of groups of temperature curves;
2. Large area IR heater preheating up for the bottom of PCB to avoid PCB deformation during working;
3. Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system,temperature precision control ±1℃;
4. Provide many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation;

Top heater(1200w)
1.Air outlet design ensure focus heating,effective
to increase success rate;
2.Top air reflow is adjustable,suit for any chips;
3.Nozzle equipped different size for different chip