ShenZhen KaiZhuo Electronic Technology Co.,Ltd
| Supply Ability | 20000 sq.m / month |
| Delivery Time | 9~10 |
| Packaging Details | vacuum |
| layers | 4 |
| material | FR4 Tg150 |
| board thickness | 1.0mm |
| Copper | 1/H/H/1 oz |
| Surface | ENIG 1u" |
| Size | 112.5*202mm / 25 UP |
| Brand Name | KAZ |
| Model Number | PCB-B-369424 |
| Certification | ISO9001, UL, RoHS |
| Place of Origin | China |
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Product Specification
| Supply Ability | 20000 sq.m / month | Delivery Time | 9~10 |
| Packaging Details | vacuum | layers | 4 |
| material | FR4 Tg150 | board thickness | 1.0mm |
| Copper | 1/H/H/1 oz | Surface | ENIG 1u" |
| Size | 112.5*202mm / 25 UP | Brand Name | KAZ |
| Model Number | PCB-B-369424 | Certification | ISO9001, UL, RoHS |
| Place of Origin | China | ||
| High Light | custom printed circuit board ，rigid flex pcb | ||
Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U" PCB Assembly Service
This is a 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper ENIG 1u" multilayer PCB circuit board, detail specification as below, with IPC Class 2 quality standard, panel size is 112.5*202mm .
Manufacturing Capacity - Rigid PCB
| Item | Production Capacity |
| Type of Products | Single Sided, double sided & multilayer |
| Max Board Size | Single & Double Sided: 600*1500mm |
| Multilayer: 600*1,200 mm | |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Golden Finger, etc. |
| Layers | 1~20 |
| Boad Thickness | 0.4~4.0mm |
| Base Copper | 18um(1/2oz), 35um (1oz), 70um (2oz), 105um (3oz), 150um (4oz), 300um (8oz) |
| Board Material | FR-4, Aluminum base, Polymide, copper base, ceramic base |
| Min Drilling Hole Size | 0.1mm |
| Min Line Width & Space | 0.075mm |
| Platting Gold | Nickle Plating Thickness 2.5~5um, gold thickness 0.05~0.1um |
| Tin Spraying | Tin thickness 2.5~5um |
| Milling Space | wire & edge: 0.15mm, hole & edge: 0.2mm, Contour Tolerance: +/-0.1mm |
| Socket Chamfer | Angle: 30°/45°/60° Depth: 1~3mm |
| V-Cut | Angle: 30°/45°/60° Depth: 1/3 of board thickness, min aise: 80*80mm |
| On-Off Test | Max Testing Area: 400*1,200mm |
| Max Testing Point: 12,000 points | |
| Max Testing Voltage: 300V | |
| Max Insulation Resistance: 100mΩ | |
| Impedance Control Tolerance | ± 10% |
| Soldering Endurance | 85℃~105℃ / 280℃~360℃ |
PCB size: 112.5*202mm / 25 UP
IPC Class 2 quality standard.
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.
Advantages of multi-layer PCBs:
Higher wiring density and complex circuit design capabilities
Better electromagnetic compatibility and signal integrity
Shorter signal transmission paths, improved circuit performance
Higher reliability and mechanical strength
More flexible power and ground distribution
Composition of multi-layer PCBs:
Inner copper foil: Provides conductive layer and wiring
Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer
Outer copper foil: Provides surface wiring and interface
Perforated metallization: Realizes electrical connection between layers
Surface treatment: HASL, ENIG, OSP and other surface treatment processes
Design and manufacture of multi-layer PCBs:
Circuit design: Signal integrity, power/ground integrity design of multi-layer boards
Layout and wiring: Reasonable layer allocation and routing optimization
Process design: Aperture size, layer spacing, copper foil thickness, etc.
Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.
More photoes for this 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper ENIG 1u" multilayer PCB
KAZ Company information
Manufacturing Equipments - Rigid PCB
Product Applicances
Product Show - Rigid PCB
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
8,800,000-11,000,000
Employee Number:
300~350
Ecer Certification：
Verified Supplier
In the year of 2024, SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD (KAZ CIRCUIT) has joined Kingsum group (www.kingsumpcba.com), to seek for a larger market share from PCB manufacturing, component sourcing, pcb assembly, and box build assembly with better price and lead time. Founded in 2007, Ka... In the year of 2024, SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD (KAZ CIRCUIT) has joined Kingsum group (www.kingsumpcba.com), to seek for a larger market share from PCB manufacturing, component sourcing, pcb assembly, and box build assembly with better price and lead time. Founded in 2007, Ka...
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