Delivery Time | 40 days |
Packaging Details | Wooden Packing |
Control System | PLC |
Cooling System | Water cooling |
Dimensions | 2000x1500x2500 mm |
Heating Power | 10 kW |
Injection Pressure | 200 MPa |
Injection Rate | 1000 cm3/s |
Machine Weight | 5 tons |
Max. Clamping Force | 1000 KN |
Mold Height | 200-500 mm |
Operation Mode | Automatic |
Platen Size | 600x600 mm |
Power Supply | AC 220V/380V |
Screw Diameter | 40 mm |
Brand Name | TJIN |
Certification | ISO9001 |
Place of Origin | China |
View Detail Information
Explore similar products
Energy Efficient Semiconductor Molding Machine Automatic Encapsulation Equipment
Auto Mold System Semiconductor Chip Making Machine High Efficiency
Auto Transfer Molding Semiconductor Manufacturing Machine High Capacity
PLC Control Efficient Chip Molding Machine In Semiconductor Manufacturing System
Product Specification
Delivery Time | 40 days | Packaging Details | Wooden Packing |
Control System | PLC | Cooling System | Water cooling |
Dimensions | 2000x1500x2500 mm | Heating Power | 10 kW |
Injection Pressure | 200 MPa | Injection Rate | 1000 cm3/s |
Machine Weight | 5 tons | Max. Clamping Force | 1000 KN |
Mold Height | 200-500 mm | Operation Mode | Automatic |
Platen Size | 600x600 mm | Power Supply | AC 220V/380V |
Screw Diameter | 40 mm | Brand Name | TJIN |
Certification | ISO9001 | Place of Origin | China |
High Light | ISO9001 Semiconductor Molding Machine ,Chip Injection Transfer Moulding Machine ,Semiconductor Transfer Moulding Machine |
Auto Chip Transfer Molding
Performance Parameters:
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Technical Parameters | Value |
---|---|
Screw Diameter | 35 mm |
Model | SM-1000 |
Clamping Force | 1000 KN |
Platen Size | 600 x 600 mm |
Cooling System | Water |
Max. Mold Height | 400 mm |
Capacity | 100 tons |
Type | Vertical Injection Molding Machine |
Injection Pressure | 200 MPa |
Heating Power | 12 KW |
Product Features | Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging |
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Heating Power: 12 KW
Control System: PLC
Clamping Force: 1000 KN
Max. Mold Height: 400 Mm
Type: Vertical Injection Molding Machine
The Semiconductor Molding Machine from TJIN is a highly efficient and advanced machine designed specifically for the molding of semiconductor materials. It is suitable for use in various industries such as electronics, automotive, and medical.
The machine is carefully packaged in wooden packaging to ensure safe transportation. It can be delivered within 40 days after placing the order, making it an ideal choice for customers with urgent production needs.
To place an order for the Semiconductor Molding Machine from TJIN, please contact us with your specific requirements and we will provide you with a competitive quote. The minimum order quantity is 1 machine, and payment can be made via TT.
Experience the precision and efficiency of the TJIN Semiconductor Molding Machine and take your production to the next level. Contact us today!
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
3 milliom
Total Annual:
5 million-10 million
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . As a professional semiconductor semi... Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . As a professional semiconductor semi...
Get in touch with us
Leave a Message, we will call you back quickly!