Guangdong Taijin Semiconductor Technology Co., Ltd
| Delivery Time | 40 days |
| Packaging Details | Wooden Packing |
| Capacity | 1000 tons |
| Clamping Force | 1000 kN |
| Control System | PLC |
| Ejector Stroke | 300 mm |
| Injection Pressure | 200 MPa |
| Injection Rate | 1000 cm3/s |
| Injection Unit Stroke | 500 mm |
| Max Mold Thickness | 1000 mm |
| Model | SM-1000 |
| Platen Size | 1500 x 1500 mm |
| Power Supply | 3 phase, 380V, 50Hz |
| Screw Diameter | 80 mm |
| Type | Vertical |
| Brand Name | TJIN |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Delivery Time | 40 days | Packaging Details | Wooden Packing |
| Capacity | 1000 tons | Clamping Force | 1000 kN |
| Control System | PLC | Ejector Stroke | 300 mm |
| Injection Pressure | 200 MPa | Injection Rate | 1000 cm3/s |
| Injection Unit Stroke | 500 mm | Max Mold Thickness | 1000 mm |
| Model | SM-1000 | Platen Size | 1500 x 1500 mm |
| Power Supply | 3 phase, 380V, 50Hz | Screw Diameter | 80 mm |
| Type | Vertical | Brand Name | TJIN |
| Certification | ISO9001 | Place of Origin | China |
| High Light | PLC Control IC Chip Molding Machine ，PLC Control ic packaging equipment | ||
Chip Molding Machine
Features
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;
● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;
● Customized on demand, permanently provide quality service.
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
| Technical Parameters | Value |
|---|---|
| Screw Diameter | 35 mm |
| Model | SM-1000 |
| Clamping Force | 1000 KN |
| Platen Size | 600 x 600 mm |
| Cooling System | Water |
| Max. Mold Height | 400 mm |
| Capacity | 100 tons |
| Type | Vertical Injection Molding Machine |
| Injection Pressure | 200 MPa |
| Heating Power | 12 KW |
| Product Features | Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging |
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
3 milliom
Total Annual:
5 million-10 million
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . As a professional semiconductor semi... Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . As a professional semiconductor semi...
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