Delivery Time | 40 days |
Packaging Details | Wooden Packing |
Application | Semiconductor Manufacturing |
Capacity | 1000 tons |
Clamping Force | 1000 kN |
Injection Pressure | 200 MPa |
Injection Speed | 100 mm/s |
Injection Unit | Single |
Max. Mold Height | 1000 mm |
Min. Mold Height | 400 mm |
Model | SM-1000 |
Platen Size | 1200 x 1200 mm |
Power Supply | 3-phase, 380V, 50Hz |
Screw Diameter | 80 mm |
Type | Injection Molding Machine |
Brand Name | TJIN |
Place of Origin | China |
Certification | ISO9001 |
View Detail Information
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Product Specification
Delivery Time | 40 days | Packaging Details | Wooden Packing |
Application | Semiconductor Manufacturing | Capacity | 1000 tons |
Clamping Force | 1000 kN | Injection Pressure | 200 MPa |
Injection Speed | 100 mm/s | Injection Unit | Single |
Max. Mold Height | 1000 mm | Min. Mold Height | 400 mm |
Model | SM-1000 | Platen Size | 1200 x 1200 mm |
Power Supply | 3-phase, 380V, 50Hz | Screw Diameter | 80 mm |
Type | Injection Molding Machine | Brand Name | TJIN |
Place of Origin | China | Certification | ISO9001 |
High Light | Auto Mold Semiconductor Chip Making Machine ,Semiconductor Chip Making Machine High Efficiency ,Auto Mold chip manufacturing equipment |
Auto Mold System
Features
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
● Automatic cassette loading, double cassette stacked loading;
● Supports flexible expansion of up to 4 groups of presses to realize high UPH;
● Equipped with vision system to recognize the feeding direction;
● WIN10 + 15 inch touch screen + touch keyboard;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;
● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;
● Customized on demand, permanently provide quality service.
Technical Parameters:
Type | Vertical Injection Molding Machine |
Control System | PLC |
Model | SM-1000 |
Cooling System | Water |
Weight | 5 Tons |
Clamping Force | 1000KN |
Capacity | 100 Tons |
Screw Diameter | 35 Mm |
Max. Mold Height | 400Mm |
Injection Pressure | 200 Mpa |
Auto Transfer Molding | Yes |
Auto Packaging Equipment | Yes |
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
3 milliom
Total Annual:
5 million-10 million
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . As a professional semiconductor semi... Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . As a professional semiconductor semi...
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