XC7K70T-1FBG676C High Performance Versatile Programmable IC Chip

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Payment Terms	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability	999999
Delivery Time	1-3 days
Packaging Details	standard
Number of LogNumber of LABs/CLBs	5125
Total RAM Bitsage (Vdss)	4976640
Number of I/ODrain (Id) @ 25°C	300
Voltage - Supplyds On, Min Rds On)	0.97V ~ 1.03V
Operating Temperature	0°C ~ 85°C (TJ)
Mounting Type	Surface Mount
PN	XC7K70T-1FBG676C
Brand Name	XILINX / AMD
Model Number	XC7K70T-1FBG676C
Place of Origin	original

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Product Details
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Product Specification


Payment Terms	L/C, D/A, D/P, T/T, Western Union, MoneyGram	Supply Ability	999999
Delivery Time	1-3 days	Packaging Details	standard
Number of LogNumber of LABs/CLBs	5125	Total RAM Bitsage (Vdss)	4976640
Number of I/ODrain (Id) @ 25°C	300	Voltage - Supplyds On, Min Rds On)	0.97V ~ 1.03V
Operating Temperature	0°C ~ 85°C (TJ)	Mounting Type	Surface Mount
PN	XC7K70T-1FBG676C	Brand Name	XILINX / AMD
Model Number	XC7K70T-1FBG676C	Place of Origin	original

XC7K70T-1FBG676C Programmable IC Chip Package 676-BBGA Voltage - Supply 0.97V ~ 1.03V

Number of LABs/CLBs	5125
Number of Logic Elements/Cells	65600
Total RAM Bits	4976640
Number of I/O	300
Voltage - Supply	0.97V ~ 1.03V
Mounting Type	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)
Package / Case	676-BBGA, FCBGA
Supplier Device Package	676-FCBGA (27x27)

Product Listing: Programmable IC Chip - XC7K70T-1FBG676C

Product Name: Programmable IC Chip - XC7K70T-1FBG676C

Product Description: The Programmable IC Chip - XC7K70T-1FBG676C is a high-performance and advanced integrated circuit designed for programmable logic applications. It offers exceptional capabilities and flexibility, making it ideal for demanding electronic projects and systems.

Product Specifications:

Model: XC7K70T-1FBG676C
Package Type: 676-pin Fine-Pitch Ball Grid Array (FBG676)
Manufacturer: Xilinx
Operating Temperature: -40°C to 100°C
Logic Cells: 66,240
Maximum User I/O Pins: 500
Block RAM: 4,860 Kbits
DSP Slices: 180
Clock Management Tiles: 6
JTAG Boundary Scan Support: Yes
Configuration Memory: Non-volatile SPI Flash
Power Supply Voltage: 1.0V core voltage, 2.5V or 3.3V I/O voltage

Key Features:

High-performance and advanced programmable logic device
Robust and reliable Fine-Pitch Ball Grid Array (FBG676) package
Large number of logic cells for complex designs
High-speed I/O capabilities for demanding applications
Abundant block RAM for efficient data storage
Dedicated DSP slices for signal processing tasks
Clock management tiles for precise timing control
JTAG boundary scan support for easy debugging and testing
Non-volatile SPI Flash for configuration storage
Wide operating temperature range for reliability
Low power consumption for energy-efficient designs

Applications:

Data center and cloud infrastructure
High-performance computing
Video processing and streaming
Wireless communication systems
FPGA prototyping and development
Image and signal processing
Industrial automation and control
Aerospace and defense systems

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Company Details

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Sai Collie Technology Co., Ltd. is a leading independent supplier and distributor of electronic components, 2007, We have been focusing on providing original equipment manufacturers (OEMs) and contract electronics manufacturers (CEMs), which are hard to find, obsolete and hot-selling integ... Sai Collie Technology Co., Ltd. is a leading independent supplier and distributor of electronic components, 2007, We have been focusing on providing original equipment manufacturers (OEMs) and contract electronics manufacturers (CEMs), which are hard to find, obsolete and hot-selling integ...

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