Product Specification

Product Introduction

The microjet laser device is a revolutionary precision machining system that achieves thermal damage-free, high-precision material processing by coupling high-energy laser beams to micron-scale liquid jets. The technology is particularly suitable for semiconductor manufacturing, enabling critical processes such as SiC/GaN wafer cutting, TSV drilling, and advanced packaging with sub-micron accuracy (0.5-5μm), while eliminating edging and heat-affected zones (HAZ<1μm) caused by traditional processing. Its unique liquid guiding mechanism not only ensures machining cleanliness (in line with Class 100 standards), but also improves yields by more than 15%, and is now the core equipment for third-generation semiconductor and 3D chip manufacturing.

Characteristics and advantages

· High precision and efficiency: Microjet laser technology achieves precise cutting and processing by coupling the laser beam into a high-speed water jet after focusing, avoiding the problems of thermal damage and material deformation in traditional laser processing, while maintaining the cooling of the processing area to ensure high precision and surface finish.

· No material damage and heat affected zones: This technology utilizes water jet cooling capabilities to create virtually no heat affected zones or microstructure changes, while removing ablative debris and keeping surfaces clean.

· Suitable for a variety of materials: metal, ceramics, composite materials, diamonds, silicon carbide and other hard and brittle materials, especially in the cutting thickness of up to millimeters of excellent performance.
 

· Flexibility and safety: The machine supports multiple modes of operation (such as 3-axis or 5-axis) and is equipped with a visual recognition system and autofocus function to improve processing efficiency and safety
 

·Environmental protection and energy saving: Compared with traditional laser processing methods, microjet laser technology reduces material loss and energy consumption, in line with the concept of green manufacturing.

Specifications

Working principle

Applications

1.Aerospace and semiconductor: used for silicon carbide ingot cutting, gallium nitride single crystal cutting, etc., to solve the processing problems of aerospace special materials.
2. Medical devices: Used for precision machining of high-quality medical device parts, such as implants, catheters, scalpels, etc., with high biocompatibility and low post-processing requirements.
3. Consumer electronics and AR equipment: achieve high-precision cutting and thinness in AR lens processing, and promote the large-scale application of new materials such as silicon carbide lenses.
4. Industrial manufacturing: widely used in metal, ceramics, composite materials complex parts processing, such as clock parts, electronic components, etc.

Q&A

1. Q: What is microjet laser technology?
    A: Microjet laser technology combines laser precision with liquid cooling to enable ultra-clean, high-accuracy material processing.

2. Q: What are the benefits of microjet laser in semiconductor manufacturing?
    A: It eliminates thermal damage and chipping while cutting/drilling fragile materials like SiC and GaN wafers.