Product Specification

Silicon wafer 4inch 8inch Single side Double side polish

Abstract

Silicon wafers are thin, flat discs sliced from high-purity single-crystal silicon ingots, serving as the foundational substrates for semiconductor devices. Their exceptional electrical conductivity properties, which can be precisely modified through doping with elements like phosphorus or boron, make them ideal for fabricating integrated circuits and transistors. These wafers are integral to the functionality of a vast array of electronic devices, including computers, smartphones, and solar cells. The manufacturing process involves crystallization techniques such as the Czochralski method, followed by precise slicing, polishing, and doping to achieve desired electrical characteristics. 

Compony Introduction

Our company, ZMSH, has been a prominent player in the semiconductor industry for over a decade, boasting a professional team of factory experts and sales personnel. We specialize in providing customized sapphire wafer solutions, offering both tailored designs and OEM services to meet diverse client needs. At ZMSH, we are committed to delivering products that excel in both price and quality, ensuring customer satisfaction at every stage. We invite you to contact us for more information or to discuss your specific requirements.

Silicon wafer Tecnical Parameters

Silicon wafer Applications

Silicon wafers are crucial components in the electronics and semiconductor industries, with a wide range of applications:

• Integrated Circuits (ICs): Silicon wafers serve as the substrate for ICs, which are essential for computers, smartphones, and many other electronic devices. They form the foundation for processors, memory chips, and other critical components.
• Solar Cells: Silicon wafers are used to produce photovoltaic (PV) cells for solar energy generation. These wafers are treated to convert sunlight into electricity efficiently.
• Sensors: Silicon-based sensors are used in various applications, including temperature sensors, pressure sensors, and motion sensors, all of which are critical in automotive, medical, and industrial sectors.
• Power Devices: Power transistors made from silicon wafers are key in managing power in electronic devices, particularly in high-voltage, high-current applications like electric vehicles and industrial equipment.
• LEDs and Optoelectronics: Silicon wafers are also used in the production of light-emitting diodes (LEDs) and other optoelectronic devices, which are used in displays, lighting, and communication systems.
• MEMS (Microelectromechanical Systems): MEMS devices, which are used in everything from accelerometers in smartphones to airbags in cars, are often fabricated on silicon wafers due to their precision and durability.

These applications demonstrate the versatility and importance of silicon wafers in modern technology.

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Silicon wafer FAQ

Q: How to make a silicon wafer?

A: To make a silicon wafer, high-purity silicon is first extracted from sand through the Siemens process. The silicon is then melted and crystallized using the Czochralski method, forming a single large crystal called a boule. This boule is carefully cooled to maintain its structure. Once solidified, the boule is sliced into thin, round wafers using a diamond saw. The slices are then polished to achieve a smooth, defect-free surface. The wafers are doped with specific impurities to alter their electrical properties and undergo further cleaning and inspection before being used in semiconductor device manufacturing.

Q: How to cut a silicon wafer?

A: Cutting a silicon wafer is a delicate process that requires precision to avoid damaging the wafer. Here's how it's done:

1. Preparation: The silicon wafer is first cleaned and inspected to ensure it is free from defects and particles.
2. Slicing: A silicon wafer is typically sliced from a larger silicon ingot or boule using a diamond saw. The saw uses a rotating blade embedded with diamonds, which provides the hardness necessary to cut through the material.
3. Cooling: During slicing, the wafer is cooled using a liquid (usually water or coolant) to prevent overheating, which can cause thermal stress or cracking.
4. Thickness Control: The thickness of the wafer is precisely controlled during the cutting process. The wafer's thickness can range from hundreds of microns to a few microns, depending on the application.
5. Polishing: After slicing, the edges of the wafer are polished to ensure smoothness and eliminate any roughness or microcracks.
6. Quality Check: The wafer is then inspected for any defects or damage that could affect its use in semiconductor manufacturing.

The cutting process is done with extreme precision to ensure the wafers maintain their structural integrity and performance for further processing.

Q: What size are silicon wafers?

A: Silicon wafers are available in several standard sizes, typically measured by their diameter. The most common sizes include 4 inches (100 mm), 6 inches (150 mm), 8 inches (200 mm), and 12 inches (300 mm). The 12-inch (300 mm) wafer is the most widely used in modern semiconductor manufacturing because it allows for higher production efficiency, providing more chips per wafer. While smaller wafers like 4-inch and 6-inch are still used in some specialized applications, larger wafers are generally preferred for cost-effectiveness in mass production of integrated circuits and semiconductor devices.