Payment Terms | T/T, |
Delivery Time | 2-4weeks |
Packaging Details | Single Wafer Container |
Polytype | 4H -SiC 6H- SiC |
Diameter | 12inch 300mm |
Conductivity | N – type / Semi-insulating |
Dopant | N2 ( Nitrogen )V ( Vanadium ) |
Orientation | On axis <0001> Off axis <0001> off 4° |
Resistivity | 0.015 ~ 0.03 ohm-cm (4H-N) |
Micropipe Density(MPD) | ≤10/cm2 ~ ≤1/cm2 |
TTV | ≤ 25 μm |
Brand Name | ZMSH |
Certification | Rohs |
Place of Origin | China |
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Product Specification
Payment Terms | T/T, | Delivery Time | 2-4weeks |
Packaging Details | Single Wafer Container | Polytype | 4H -SiC 6H- SiC |
Diameter | 12inch 300mm | Conductivity | N – type / Semi-insulating |
Dopant | N2 ( Nitrogen )V ( Vanadium ) | Orientation | On axis <0001> Off axis <0001> off 4° |
Resistivity | 0.015 ~ 0.03 ohm-cm (4H-N) | Micropipe Density(MPD) | ≤10/cm2 ~ ≤1/cm2 |
TTV | ≤ 25 μm | Brand Name | ZMSH |
Certification | Rohs | Place of Origin | China |
High Light | 4H-N Silicon Carbide wafer ,12 Inch Silicon Carbide wafer ,300mm Silicon Carbide wafer |
12inch SiC wafer Silicon Carbide wafer 300mm 750±25um 4H-N type orientation 100 Production Research grade
12inch SiC wafer's abstract
This 12-inch Silicon Carbide (SiC) wafer is designed for advanced semiconductor applications, featuring a 300mm diameter, 750±25µm thickness, and a 4H-N type crystal orientation with a polytype of 4H-SiC. The wafer is produced using high-quality manufacturing techniques to meet the standards of research-grade and production environments. Its robust properties make it well-suited for high-power, high-temperature, and high-frequency devices, often used in applications such as electric vehicles (EVs), power electronics, and RF technology. The wafer’s superior structural integrity and precise specifications ensure high yields in device fabrication, offering optimal performance in cutting-edge research and industrial applications.
12inch SiC wafer's data chart
1 2 inch Silicon Carbide (SiC) Substrate Specification | |||||
Grade | ZeroMPD Production Grade(Z Grade) | Standard Production Grade(P Grade) | Dummy Grade (D Grade) | ||
Diameter | 3 0 0 mm~1305mm | ||||
Thickness | 4H-N | 750μm±15 μm | 750μm±25 μm | ||
4H-SI | 750μm±15 μm | 750μm±25 μm | |||
Wafer Orientation | Off axis : 4.0° toward <1120 >±0.5° for 4H-N, On axis : <0001>±0.5° for 4H-SI | ||||
Micropipe Density | 4H-N | ≤0.4cm-2 | ≤4cm-2 | ≤25cm-2 | |
4H-SI | ≤5cm-2 | ≤10cm-2 | ≤25cm-2 | ||
Resistivity | 4H-N | 0.015~0.024 Ω·cm | 0.015~0.028 Ω·cm | ||
4H-SI | ≥1E10 Ω·cm | ≥1E5 Ω·cm | |||
Primary Flat Orientation | {10-10} ±5.0° | ||||
Primary Flat Length | 4H-N | N/A | |||
4H-SI | Notch | ||||
Edge Exclusion | 3 mm | ||||
LTV/TTV/Bow /Warp | ≤5μm/≤15μm/≤35 μm/≤55 μm | ≤5μm/≤15μm/≤35 □ μm/≤55 □ μm | |||
Roughness | Polish Ra≤1 nm | ||||
CMP Ra≤0.2 nm | Ra≤0.5 nm | ||||
Edge Cracks By High Intensity Light Hex Plates By High Intensity Light Polytype Areas By High Intensity Light Visual Carbon Inclusions Silicon Surface Scratches By High Intensity Light | None Cumulative area ≤0.05% None Cumulative area ≤0.05% None | Cumulative length ≤ 20 mm, single length≤2 mm Cumulative area ≤0.1% Cumulative area≤3% Cumulative area ≤3% Cumulative length≤1×wafer diameter | |||
Edge Chips By High Intensity Light | None permitted ≥0.2mm width and depth | 7 allowed, ≤1 mm each | |||
(TSD) Threading screw dislocation | ≤500 cm-2 | N/A | |||
(BPD) Base plane dislocation | ≤1000 cm-2 | N/A | |||
Silicon Surface Contamination By High Intensity Light | None | ||||
Packaging | Multi-wafer Cassette Or Single Wafer Container | ||||
Notes: | |||||
1 Defects limits apply to entire wafer surface except for the edge exclusion area. 2The scratches should be checked on Si face only. 3 The dislocation data is only from KOH etched wafers. |
12inch SiC wafer's photo
12inch SiC wafer's properties
12inch SiC wafer's applications
12-inch SiC wafers are primarily used in high-performance power electronics, including power MOSFETs, diodes, and IGBTs, enabling efficient energy conversion in industries such as electric vehicles, renewable energy, and industrial power systems. SiC’s high thermal conductivity, wide bandgap, and ability to withstand high temperatures make it ideal for applications in automotive electronics, power inverters, and high-power energy systems. Its use in high-frequency RF devices and microwave communication systems also makes it critical for telecommunications, aerospace, and military radar systems.
Additionally, SiC wafers are used in LED and optoelectronics, serving as substrates for blue and UV LEDs, which are crucial for lighting, displays, and sterilization. The material's resilience in harsh environments enables its use in high-temperature sensors, medical devices, and satellite power systems. With its growing role in smart grids, energy storage, and power distribution, SiC is helping to improve efficiency, reliability, and performance across a wide range of applications.
12inch SiC wafer's Q&A
Answer: A 12-inch SiC wafer is a silicon carbide (SiC) substrate with a diameter of 12 inches, primarily used in the semiconductor industry, especially for high-power, high-temperature, and high-frequency applications. SiC materials are widely used in power electronics, automotive electronics, and energy conversion devices due to their excellent electrical, thermal, and mechanical properties.
Answer: The advantages of a 12-inch SiC wafer include:
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification:
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op...
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