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SHANGHAI FAMOUS TRADE CO.,LTD

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China 12inch SiC Wafer Silicon Carbide Wafer 300mm Substrate 750±25um 4H-N Type
China 12inch SiC Wafer Silicon Carbide Wafer 300mm Substrate 750±25um 4H-N Type

  1. China 12inch SiC Wafer Silicon Carbide Wafer 300mm Substrate 750±25um 4H-N Type
  2. China 12inch SiC Wafer Silicon Carbide Wafer 300mm Substrate 750±25um 4H-N Type
  3. China 12inch SiC Wafer Silicon Carbide Wafer 300mm Substrate 750±25um 4H-N Type
  4. China 12inch SiC Wafer Silicon Carbide Wafer 300mm Substrate 750±25um 4H-N Type

12inch SiC Wafer Silicon Carbide Wafer 300mm Substrate 750±25um 4H-N Type

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Payment Terms T/T,
Delivery Time 2-4weeks
Packaging Details Single Wafer Container
Polytype 4H -SiC 6H- SiC
Diameter 12inch 300mm
Conductivity N – type / Semi-insulating
Dopant N2 ( Nitrogen )V ( Vanadium )
Orientation On axis <0001> Off axis <0001> off 4°
Resistivity 0.015 ~ 0.03 ohm-cm (4H-N)
Micropipe Density(MPD) ≤10/cm2 ~ ≤1/cm2
TTV ≤ 25 μm
Brand Name ZMSH
Certification Rohs
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Delivery Time 2-4weeks
Packaging Details Single Wafer Container Polytype 4H -SiC 6H- SiC
Diameter 12inch 300mm Conductivity N – type / Semi-insulating
Dopant N2 ( Nitrogen )V ( Vanadium ) Orientation On axis <0001> Off axis <0001> off 4°
Resistivity 0.015 ~ 0.03 ohm-cm (4H-N) Micropipe Density(MPD) ≤10/cm2 ~ ≤1/cm2
TTV ≤ 25 μm Brand Name ZMSH
Certification Rohs Place of Origin China
High Light 4H-N Silicon Carbide wafer12 Inch Silicon Carbide wafer300mm Silicon Carbide wafer

 

 

12inch SiC wafer Silicon Carbide wafer 300mm 750±25um 4H-N type orientation 100 Production Research grade

 

 

12inch SiC wafer's abstract

 

This 12-inch Silicon Carbide (SiC) wafer is designed for advanced semiconductor applications, featuring a 300mm diameter, 750±25µm thickness, and a 4H-N type crystal orientation with a polytype of 4H-SiC. The wafer is produced using high-quality manufacturing techniques to meet the standards of research-grade and production environments. Its robust properties make it well-suited for high-power, high-temperature, and high-frequency devices, often used in applications such as electric vehicles (EVs), power electronics, and RF technology. The wafer’s superior structural integrity and precise specifications ensure high yields in device fabrication, offering optimal performance in cutting-edge research and industrial applications.

 


 

 

12inch SiC wafer's data chart

 

1 2 inch Silicon Carbide (SiC) Substrate Specification
Grade ZeroMPD Production
Grade(Z Grade)
Standard Production
Grade(P Grade)
Dummy Grade
(D Grade)
Diameter 3 0 0 mm~1305mm
Thickness 4H-N 750μm±15 μm 750μm±25 μm
4H-SI 750μm±15 μm 750μm±25 μm
Wafer Orientation Off axis : 4.0° toward <1120 >±0.5° for 4H-N, On axis : <0001>±0.5° for 4H-SI
Micropipe Density 4H-N ≤0.4cm-2 ≤4cm-2 ≤25cm-2
4H-SI ≤5cm-2 ≤10cm-2 ≤25cm-2
Resistivity 4H-N 0.015~0.024 Ω·cm 0.015~0.028 Ω·cm
4H-SI ≥1E10 Ω·cm ≥1E5 Ω·cm
Primary Flat Orientation {10-10} ±5.0°
Primary Flat Length 4H-N N/A
4H-SI Notch
Edge Exclusion 3 mm
LTV/TTV/Bow /Warp ≤5μm/≤15μm/≤35 μm/≤55 μm ≤5μm/≤15μm/≤35 □ μm/≤55 □ μm
Roughness Polish Ra≤1 nm
CMP Ra≤0.2 nm Ra≤0.5 nm
Edge Cracks By High Intensity Light
Hex Plates By High Intensity Light
Polytype Areas By High Intensity Light
Visual Carbon Inclusions

Silicon Surface Scratches By High Intensity Light
None
Cumulative area ≤0.05%
None
Cumulative area ≤0.05%
None
Cumulative length ≤ 20 mm, single length≤2 mm
Cumulative area ≤0.1%
Cumulative area≤3%
Cumulative area ≤3%
Cumulative length≤1×wafer diameter
Edge Chips By High Intensity Light None permitted ≥0.2mm width and depth 7 allowed, ≤1 mm each
(TSD) Threading screw dislocation 500 cm-2 N/A
(BPD) Base plane dislocation 1000 cm-2 N/A
Silicon Surface Contamination By High Intensity Light None
Packaging Multi-wafer Cassette Or Single Wafer Container
Notes:
1 Defects limits apply to entire wafer surface except for the edge exclusion area.
2The scratches should be checked on Si face only.
3 The dislocation data is only from KOH etched wafers.

 

 


 

12inch SiC wafer's photo

 

 

 


 

12inch SiC wafer's properties

 

 

1. Material Properties of SiC:

  • Wide Bandgap: SiC has a wide bandgap (~3.26 eV), allowing it to operate at higher voltages, temperatures, and frequencies compared to traditional silicon (Si).
  • High Thermal Conductivity: SiC's thermal conductivity is much higher than silicon (about 3.7 W/cm·K), making it well-suited for high-power applications where heat dissipation is critical.
  • High Breakdown Voltage: SiC can handle much higher voltages (up to 10 times higher than silicon), making it ideal for power electronics, such as power transistors and diodes.
  • High Electron Mobility: The electron mobility in SiC is higher than in traditional silicon, contributing to faster switching times in electronic devices.

2. Mechanical Properties:

  • High Hardness: SiC is very hard (Mohs hardness of 9), which contributes to its wear resistance but also makes it difficult to process and machine.
  • Stiffness: It has a high Young's modulus, meaning it is stiffer and more durable compared to silicon, which enhances its robustness in devices.
  • Brittleness: SiC is more brittle than silicon, which is important to consider during wafer processing and device manufacturing.

 


 

 

12inch SiC wafer's applications

 

 

12-inch SiC wafers are primarily used in high-performance power electronics, including power MOSFETs, diodes, and IGBTs, enabling efficient energy conversion in industries such as electric vehicles, renewable energy, and industrial power systems. SiC’s high thermal conductivity, wide bandgap, and ability to withstand high temperatures make it ideal for applications in automotive electronics, power inverters, and high-power energy systems. Its use in high-frequency RF devices and microwave communication systems also makes it critical for telecommunications, aerospace, and military radar systems.

 

Additionally, SiC wafers are used in LED and optoelectronics, serving as substrates for blue and UV LEDs, which are crucial for lighting, displays, and sterilization. The material's resilience in harsh environments enables its use in high-temperature sensors, medical devices, and satellite power systems. With its growing role in smart grids, energy storage, and power distribution, SiC is helping to improve efficiency, reliability, and performance across a wide range of applications.

 


 

12inch SiC wafer's Q&A

 

1. What is a 12-inch SiC wafer?

Answer: A 12-inch SiC wafer is a silicon carbide (SiC) substrate with a diameter of 12 inches, primarily used in the semiconductor industry, especially for high-power, high-temperature, and high-frequency applications. SiC materials are widely used in power electronics, automotive electronics, and energy conversion devices due to their excellent electrical, thermal, and mechanical properties.

2. What are the advantages of a 12-inch SiC wafer?

Answer: The advantages of a 12-inch SiC wafer include:

  • High Temperature Stability: SiC can operate at temperatures up to 600°C or higher, offering better high-temperature performance than traditional silicon materials.
  • High Power Handling: SiC can withstand high voltage and current, making it suitable for high-power applications such as electric vehicle battery management and industrial power supplies.
  • High Thermal Conductivity: SiC has a significantly higher thermal conductivity compared to silicon, which helps in better heat dissipation, improving device reliability and efficiency.

 

Tag:12-inch SiC wafer     12inch SiC substrate
 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

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Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Agent,Importer,Exporter,Trading Company

  • Year Established:

    2013

  • Total Annual:

    1000000-1500000

  • Ecer Certification:

    Verified Supplier

SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op...

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  • SHANGHAI FAMOUS TRADE CO.,LTD
  • Rm5-616,NO.851,Dianshanhu road; Qingpu area;shanghai city//201799
  • https://www.sapphire-substrate.com/

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