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Bicheng Electronics Technology Co., Ltd

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China 60mil RO4730G3 PCB Double-Sided Circuit For Cellular Base Station Antennas
China 60mil RO4730G3 PCB Double-Sided Circuit For Cellular Base Station Antennas

  1. China 60mil RO4730G3 PCB Double-Sided Circuit For Cellular Base Station Antennas
  2. China 60mil RO4730G3 PCB Double-Sided Circuit For Cellular Base Station Antennas

60mil RO4730G3 PCB Double-Sided Circuit For Cellular Base Station Antennas

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99/PCS
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material RO4730G3
Layer count 2-layer
PCB size 158mm x 127 mm=1PCS, +/- 0.15mm
PCB thickness 60 mil
Copper weight 1oz (1.4 mils) outer layers
Surface finish Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
Material RO4730G3 Layer count 2-layer
PCB size 158mm x 127 mm=1PCS, +/- 0.15mm PCB thickness 60 mil
Copper weight 1oz (1.4 mils) outer layers Surface finish Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Brand Name Bicheng Certification UL, ISO9001, IATF16949
Place of Origin CHINA
High Light Double-Sided Circuit PCBRO4730G3 PCBCellular Base Station Antennas PCB

Introducing the Rogers RO4730G3 PCB, a state-of-the-art solution designed for high-performance antenna applications. This hydrocarbon/ceramic/ woven glass laminate is a reliable and cost-effective alternative to traditional PTFE-based materials, making it an ideal choice for modern circuit designs.

 

Key Features
- Dielectric Constant (Dk): 3.0 ± 0.05 at 10GHz
- Dissipation Factor: 0.0028 at 10GHz
- Thermal Coefficient of Dk: 34 ppm/°C
- Coefficient of Thermal Expansion: Matched to copper (x: 15.9 ppm/°C, y: 14.4 ppm/°C, z: 35.2 ppm/°C)
- Glass Transition Temperature (Tg): >280 °C
- Decomposition Temperature (Td): 411 °C (TGA)
- Thermal Conductivity: 0.45 W/mK

 

Benefits
- Low Loss Dielectric: Ensures reduced Passive Intermodulation (PIM) and low insertion loss.
- Lightweight Construction: 30% lighter than PTFE/glass laminates, enhancing design flexibility.
- High Tg and Low Z-axis CTE: Offers automated assembly compatibility and design versatility.
- Consistent Circuit Performance: Low TCDk (<40 ppm/°C) guarantees reliable operation.
- Eco-Friendly: Fully compatible with lead-free processes and RoHS compliant.

 

PCB Specifications
- Stackup: 2-layer rigid PCB

- Copper Layer 1: 35 μm
- Core Material: Rogers RO4730G3, 1.524 mm (60 mil)
- Copper Layer 2: 35 μm

 

- Board Dimensions: 158 mm x 127 mm (± 0.15 mm)
- Trace/Space: Minimum of 4/6 mils
- Hole Size: Minimum of 0.3 mm
- Finished Board Thickness: 1.6 mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
- Silkscreen: White top, no bottom; Blue solder mask on top, no bottom
- Electrical Testing: 100% electrical test prior to shipment


Artwork & Quality
- Artwork Type: Gerber RS-274-X
- Quality Standard: IPC-Class-2
- Availability: Worldwide

 

Applications
The Rogers RO4730G3 PCB is particularly well-suited for:

 

- Cellular Base Station Antennas

 

RO4730G3 Typical Value
Property RO4730G3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.98 Z   1.7 GHz to 5 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0028 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
  2.5 GHz
Thermal Coefficient of ε +34 Z ppm/℃ -50 ℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability <0.4 X, Y mm/m after etech +E2/150 ℃ IPC-TM-650 2.4.39A
Volume Resistivity (0.030") 9 X 107   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity (0.030") 7.2 X 105   COND A IPC-TM-650 2.5.17.1
PIM -165   dBc 50 ohm 0.060" 43 dBm 1900 MHz
Electrical Strength (0.030") 730 Z V/mil   IPC-TM-650 2.5.6.2
Flexural Strength MD 181 (26.3)   Mpa (kpsi) RT ASTM D790
CMD 139 (20.2)  
Moisure Absorption 0.093 - % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity 0.45 Z W/mK 50℃ ASTM D5470
Coefficient of Thermal Expansion 15.9
14.4
35.2
X
Y
Z
ppm/℃ -50 ℃to 288℃ IPC-TM-650 2.4.4.1
Tg >280     IPC-TM-650 2.4.24
Td 411     ASTM D3850
Density 1.58   gm/cm3   ASTM D792
Copper Peel Stength 4.1   pli 1oz,LoPro EDC IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Unlocking Performance: The Rogers RO4730G3 PCB for Modern Antennas

 

In the rapidly evolving world of electronics, the quest for high-performance printed circuit boards (PCBs) is paramount. One standout innovation is the Rogers RO4730G3 PCB, specifically designed to meet the demanding needs of antenna applications.

 

Key Features of the RO4730G3

The Rogers RO4730G3 PCB boasts impressive dielectric properties, including a dielectric constant (Dk) of 3.0 ± 0.05 at 10GHz and a low dissipation factor of 0.0028. These characteristics ensure minimal energy loss during signal transmission, making it ideal for high-frequency communications. Additionally, with a glass transition temperature (Tg) exceeding 280 °C, the RO4730G3 can withstand harsh thermal environments without compromising its integrity.

 

Understanding Thermal Stability

Thermal stability is crucial in PCB design, especially for antenna applications. The RO4730G3 features a decomposition temperature (Td) of 411 °C, which further underscores its reliability in demanding situations. Matched to copper, the coefficient of thermal expansion (CTE) minimizes thermal stress, ensuring long-term performance and durability.

 

Advantages of Low Loss Dielectric

One of the most significant advantages of the Rogers RO4730G3 is its low loss dielectric, which leads to reduced Passive Intermodulation (PIM) and low insertion loss. This results in enhanced signal integrity, critical for applications such as cellular base station antennas. By utilizing a lightweight construction—approximately 30% lighter than standard PTFE/glass laminates—the RO4730G3 offers exceptional performance without the burden of additional weight.

 

Design Flexibility and Compatibility

With a low Z-axis CTE of less than 30 ppm/°C, the RO4730G3 PCB allows for greater design flexibility. Its compatibility with automated assembly processes simplifies manufacturing, making it an attractive choice for designers looking to optimize both performance and cost efficiency. The specially formulated thermoset resin system enhances ease of fabrication while maintaining high reliability.

 

 

Environmental Considerations: A Sustainable Option

In an era where sustainability is paramount, the Rogers RO4730G3 PCB shines as an eco-friendly choice. It is compatible with lead-free processes and complies with RoHS standards, providing a responsible solution for modern electronic demands. This commitment to environmental stewardship ensures that designers can achieve high performance without compromising on sustainability.

 

Applications of Rogers RO4730G3 PCBs

The versatility of the Rogers RO4730G3 makes it suitable for a wide range of applications, particularly in the telecommunications sector. From cellular base station antennas to RFID and wireless applications, its unique properties enable reliable performance across various high-frequency scenarios.

 

Conclusion: The Future of Antenna Technology

As we look to the future of PCB technology, the Rogers RO4730G3 PCB represents a significant advancement for antenna design. With its combination of high-performance characteristics, eco-friendliness, and cost-effectiveness, it is poised to become a staple in the development of next-generation electronic devices.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...

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  • Reach Us
  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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