25mil TMM3 PCB with Immersion Silver for RF and Microwave Applications

Product Specification

Introduction to Rogers TMM3

The Rogers TMM3 is a thermoset microwave material crafted from a ceramic thermoset polymer composite. This innovative material is specifically engineered for strip-line and micro-strip applications, combining the best attributes of ceramic and traditional PTFE microwave circuit laminates. Unlike many conventional materials, TMM3 does not require specialized production techniques, making it a versatile and accessible choice for engineers.

Construction Details

The TMM3 PCB features a robust 2-layer rigid stackup:

Copper Layer 1: 35 μm
RogersTMM3 Core: 0.635 mm (25 mil)

Copper Layer 2: 35 μm

Specifications:

Board Dimensions: 42.91 mm x 108.31 mm (± 0.15 mm)

Minimum Trace/Space: 5/9 mils

Minimum Hole Size: 0.3 mm

Finished Board Thickness: 0.7 mm

Finished Copper Weight: 1 oz (1.4 mils) on outer layers

Surface Finish: Immersion Silver

Quality Assurance: Each PCB undergoes a 100% electrical test prior to shipment, ensuring reliability and performance.

Typical Applications

The Rogers TMM3 PCB is particularly well-suited for:

RF and Microwave Circuitry: Ideal for applications requiring precision and high-frequency performance.

Power Amplifiers and Combiners: Ensures efficient signal transmission and minimal loss.

Satellite Communication Systems: Provides reliable performance in demanding environments.

Chip Testers and Patch Antennas: Facilitates accurate testing and high performance.

In the fast-evolving realm of electronics, the quest for high-performance printed circuit boards (PCBs) is ever more critical, particularly in sectors like telecommunications and aerospace. Enter the Rogers TMM3 PCB, a groundbreaking solution designed specifically for high-frequency applications. This article provides an in-depth look at the TMM3’s standout features, benefits, and diverse applications, showcasing why it has become a go-to choice for engineers and manufacturers.

Exceptional Dielectric Performance

- Dielectric Constant (Dk): At 3.27 ± 0.032 at 10 GHz, the TMM3 PCB ensures minimal signal distortion, crucial for high-frequency transmission. It can achieve values of 3.45 across a broader frequency range of 8 GHz to 40 GHz, demonstrating its versatility.

- Dissipation Factor (Df): With a remarkably low dissipation factor of 0.002, the TMM3 minimizes energy loss, thereby enhancing the overall efficiency of electronic circuits.

- Thermal Coefficient of Dielectric Constant: The thermal stability is impressive, with a coefficient of +37 ppm/°K, ensuring reliable performance across temperatures from -55°C to 125°C.

Robust Mechanical and Thermal Properties

- Decomposition Temperature (Td): With a high Td of 425°C, the TMM3 is well-equipped to handle high-temperature environments.

- Coefficient of Thermal Expansion (CTE): The CTE closely aligns with that of copper, measuring 15 ppm/K in both the X and Y directions and 23 ppm/K in the Z direction. This minimizes stress on plated through-holes, which is vital for maintaining electrical integrity.

- Flexural Strength: With a flexural strength of 16.53 kpsi, the TMM3 is built to withstand mechanical stresses, ensuring durability in demanding applications.

Impressive Electrical Properties

- Insulation Resistance: The TMM3 PCB features an insulation resistance exceeding 2000 GΩ, providing excellent electrical isolation.

- Volume Resistivity: Rated at 2 x 10^9 Ω·cm, this PCB exhibits robust performance across various applications.

- Electrical Strength: With a dielectric strength of 441 V/mil, the TMM3 can endure high voltages without compromising performance.

Why Choose Rogers TMM3 PCB?

1. Consistent Reliability: The combination of low Dk, low Df, and high insulation resistance ensures that the TMM3 PCB maintains exceptional signal integrity under challenging conditions.

2. Streamlined Manufacturing: The material is compatible with lead-free processes and does not require sodium naphthenate treatment before electroless plating, simplifying production and reducing costs.

3. Versatile Applications: The TMM3 PCB shines in various applications, including RF and microwave circuitry, power amplifiers, filters, and satellite communication systems.

4. Durability and Longevity: The mechanical resilience of the TMM3—characterized by high peel strength and flexural strength—ensures it can withstand the rigors of demanding environments, offering long-term reliability.

Ideal Applications for Rogers TMM3

The Rogers TMM3 PCB is perfectly suited for numerous applications, such as:

- RF and Microwave Circuitry: An ideal choice for applications requiring precision and high-frequency capabilities.
 

- Power Amplifiers and Combiners: Facilitates efficient signal transmission with minimal loss.
 

- Satellite Communication Systems: Delivers dependable performance in challenging conditions.
 

- Global Positioning Systems (GPS) Antennas: Ensures accurate signal reception and transmission.

Conclusion: Elevating Electronic Solutions with Rogers TMM3

The Rogers TMM3 PCB stands as a beacon of innovation in high-frequency PCB technology. Its unique blend of features—ranging from a low dielectric constant and excellent thermal stability to impressive mechanical strength—positions it as a preferred option for engineers and manufacturers eager to push the boundaries of electronic design.

As the demand for sophisticated electronic solutions continues to rise, the TMM3 PCB is poised to meet these challenges with unmatched reliability and performance. For more information on how the Rogers TMM3 can elevate your projects or to request a quote, please reach out to us today. Your journey towards cutting-edge electronic solutions starts here!