Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Material | TLY-5Z |
Layer count | 2-layer |
PCB size | 90.17mm x 41.36 mm=1PCS, +/- 0.15mm |
PCB thickness | 0.3 mm |
Copper weight | 1oz (1.4 mils) outer layers |
Surface finish | Immersion Gold |
Brand Name | Bicheng |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Material | TLY-5Z | Layer count | 2-layer |
PCB size | 90.17mm x 41.36 mm=1PCS, +/- 0.15mm | PCB thickness | 0.3 mm |
Copper weight | 1oz (1.4 mils) outer layers | Surface finish | Immersion Gold |
Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
In the competitive landscape of aerospace engineering, the need for innovative, lightweight, and thermally stable materials is more critical than ever. The TLY-5Z PCB emerges as a leading solution, specifically tailored to meet the demanding requirements of high-performance applications. This article delves into the key features, benefits, and applications of the TLY-5Z PCB, highlighting why it is an essential choice for engineers and manufacturers.
Introduction to TLY-5Z Laminates
The TLY-5Z PCB is constructed from advanced glass-filled PTFE composites reinforced with woven fiberglass. This unique composition provides exceptional dimensional stability and thermal performance, making it ideal for aerospace components where weight savings are crucial.
Key Properties of the TLY-5Z PCB
The TLY-5Z boasts impressive specifications that make it stand out in the industry:
- Dielectric Constant (Dk): 2.20 ± 0.04 at 1.9 GHz and 10 GHz, ensuring minimal signal loss.
- Dissipation Factor (Df): 0.001 at 1.9 GHz and 0.0015 at 10 GHz, enhancing energy efficiency.
- Thermal Stability: With a thermal coefficient of dielectric constant (TcDK) of -72 ppm/°C across a temperature range of -55°C to 150°C, it provides reliable performance in extreme conditions.
- Moisture Absorption: At just 0.03%, moisture absorption is minimal, ensuring durability in humid environments.
- Dielectric Breakdown Voltage: 45 kV, ensuring safety and reliability.
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 2.20+/- 0.04 | 2.20+/- 0.04 | ||
Df @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 0.001 | 0.001 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0015 | 0.0015 | ||
Tc(D)K (-55 ~150°C) | IPC-650 2.5.5.6 Mod. | ppm/°C | -72 | ppm/°C | -72 |
Dielectric Breakdown Voltage | IPC-650 2.5.6 | kV | 45 | kV | 45 |
Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 770 | V/mm | 30,315 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
Peel Strength (1 oz. copper) | IPC-650 2.4.8 | lbs./inch | 7 | N/mm | 1.3 |
Volume Resistivity | IPC-650 2.5.17.1 | Mohms/cm | 10^9 | Mohms/cm | 10^9 |
Surface Resistivity | IPC-650 2.5.17.1 | Mohms | 10^8 | Mohms | 10^8 |
Tensile Strength (MD) | IPC-650 2.4.18.3 | psi | 9137 | N/mm2 | 63 |
Tensile Strength (CD) | IPC-650 2.4.18.3 | psi | 9572 | N/mm2 | 66 |
Tensile Modulus (MD) | IPC-650 2.4.18.3 | psi | 182,748 | N/mm2 | 1260 |
Tensile Modulus (CD) | IPC-650 2.4.18.3 | psi | 165,344 | N/mm2 | 1140 |
Elongation (MD) | IPC-650 2.4.18.3 | % | 6 | % | 6 |
Elongation (CD) | IPC-650 2.4.18.3 | % | 6.9 | % | 6.9 |
Flex Strength (MD) | ASTM D790 | psi | 10,300 | N/mm2 | 71 |
Flex Strength (CD) | ASTM D790 | psi | 11,600 | N/mm2 | 80 |
Flex Modulus (MD) | ASTM D790 | psi | 377,100 | N/mm2 | 2600 |
Flex Modulus (CD) | ASTM D790 | psi | 432,213 | N/mm2 | 2980 |
Dimensional Stability (MD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.05 | % (30 mil) | -0.05 |
Dimensional Stability (CD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.17 | % (30 mil) | -0.11 |
Dimensional Stability (MD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.07 | % (30 mil) | -0.07 |
Dimensional Stability (CD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.22 | % (30 mil) | -0.14 |
Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 1.92 | g/cm3 | 1.92 |
Specific Heat | IPC-650 2.4.50 | J/g°C | 0.95 | J/g°C | 0.95 |
Thermal Conductivity | IPC-650 2.4.50 | W/M*K | 0.2 | W/M*K | 0.2 |
CTE (x-y) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 30-40 | ppm/ºC | 30-40 |
CTE (z) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 130 | ppm/ºC | 130 |
Hardness | ASTM D2240 (Durometer) | - | 68 | - | 68 |
UL-94 Flammability Rating | UL-94 | V-0 | V-0 |
Benefits of Choosing TLY-5Z for Your Projects
The TLY-5Z PCB offers significant advantages, including:
Low Z-Axis CTE
The low Z-axis Coefficient of Thermal Expansion (CTE) of 130 ppm/°C minimizes expansion-related stress on plated through holes, crucial for maintaining reliable electrical connections.
Lightweight Design
With a density of 1.92 g/cm3, the TLY-5Z is exceptionally lightweight, making it ideal for aerospace applications where every gram counts.
Excellent Mechanical Properties
The TLY-5Z exhibits impressive mechanical strength, with tensile strengths of 9,137 psi (MD) and 9,572 psi (CD). Its peel strength is 7 lbs/inch, ensuring robust layer adhesion.
Construction Details: What Makes TLY-5Z Stand Out
This 2-layer rigid PCB features:
- Copper Layer 1: 35 μm
- TLY-5Z Layer: 0.254 mm (10 mil)
- Copper Layer 2: 35 μm
With dimensions of 90.17 mm x 41.36 mm, this PCB is engineered for precision, supporting a minimum trace/space of 5/6 mils and a minimum hole size of 0.2 mm. Each board undergoes a 100% electrical test prior to shipment, ensuring quality and reliability.
PCB Material: | Composites of Ceramic, PTFE and Woven Fiberglass |
Designation: | TLY-5Z |
Dielectric constant: | 2.20 +/- 0.04 (1.9GHz) |
Dissipation Factor | 0.0015 (10GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Applications in Aerospace and Beyond
The TLY-5Z PCB is particularly well-suited for:
- Aerospace Components: Its lightweight and thermally stable properties make it ideal for aircraft systems where reliability is critical.
- Low-Weight Antennas: Perfect for antennas that must perform under strict weight constraints.
- RF Passive Components: The low dissipation factor enhances performance, ensuring signal integrity.
Conclusion: Future Prospects for TLY-5Z PCB Technology
As the aerospace industry continues to evolve, the TLY-5Z PCB represents a significant advancement in lightweight, thermally stable solutions. Its unique properties, combined with robust construction and competitive pricing, make it an indispensable tool for engineers and manufacturers.
Discover the perfect balance of weight and strength with the TLY-5Z PCB and elevate your projects to new heights. For more information on how to order this PCB online, contact us today!
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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